Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11049792 | Package structure for semiconductor devices | Gareth Pryce Weale, Joseph Steffler | 2021-06-29 |
| 10867893 | Semiconductor devices and methods for forming a semiconductor device | Sergey Ananiev, Robert Bauer, Heinrich Koerner, Juergen Walter | 2020-12-15 |
| 9852918 | Embedding additive particles in encapsulant of electronic device | Peh Hean Teh, Jagen Krishnan, Swee Kah Lee, Poh Cheng Lim, Joachim Mahler +2 more | 2017-12-26 |
| 9540539 | Primer composition, method of forming a primer layer on a semiconductor device, and method of encapsulating a semiconductor device | Swee Kah Lee, Joachim Mahler, Chew Theng Tai, Soon Lock Goh, Poh Cheng Lim +2 more | 2017-01-10 |