Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11757170 | Semiconductor device and package | Gareth Pryce Weale | 2023-09-12 |
| 11139552 | Method of forming a semiconductor device | Gareth Pryce Weale | 2021-10-05 |
| 11049792 | Package structure for semiconductor devices | Gareth Pryce Weale, Yik Yee Tan | 2021-06-29 |
| 10468336 | High density semiconductor package and related methods | Sukhminder S. Binapal, Mark Vandermeulen | 2019-11-05 |