Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10468336 | High density semiconductor package and related methods | Joseph Steffler, Mark Vandermeulen | 2019-11-05 |
| 6133626 | Three dimensional packaging configuration for multi-chip module assembly | Robert E. Hawke, Atin J. Patel, Charles Divita, Lynn McNeil, Thomas Fletcher | 2000-10-17 |