Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6133626 | Three dimensional packaging configuration for multi-chip module assembly | Robert E. Hawke, Atin J. Patel, Sukhminder S. Binapal, Lynn McNeil, Thomas Fletcher | 2000-10-17 |