HK

Heinrich Koerner

Infineon Technologies Ag: 26 patents #247 of 7,486Top 4%
SA Siemens Aktiengesellschaft: 2 patents #6,658 of 22,248Top 30%
📍 Bruckmühl, DE: #2 of 78 inventorsTop 3%
Overall (All Time): #136,480 of 4,157,543Top 4%
28
Patents All Time

Issued Patents All Time

Showing 1–25 of 28 patents

Patent #TitleCo-InventorsDate
12033972 Chip package, method of forming a chip package and method of forming an electrical contact Joachim Mahler, Michael Bauer, Jochen Dangelmaier, Reimund Engl, Johann Gatterbauer +6 more 2024-07-09
10978418 Method of forming an electrical contact and method of forming a chip package with a metal contact structure and protective layer Joachim Mahler, Michael Bauer, Jochen Dangelmaier, Reimund Engl, Johann Gatterbauer +6 more 2021-04-13
10867893 Semiconductor devices and methods for forming a semiconductor device Sergey Ananiev, Robert Bauer, Yik Yee Tan, Juergen Walter 2020-12-15
10672678 Method for forming a chip package with compounds to improve the durability and performance of metal contact structures in the chip package Michael Bauer, Reimund Engl, Michael Huettinger, Werner Kanert, Joachim Mahler +1 more 2020-06-02
10497634 Chip package comprising a chemical compound and a method of forming a chip package comprising a chemical compound Michael Bauer, Reimund Engl, Michael Huettinger, Werner Kanert, Joachim Mahler +1 more 2019-12-03
10461056 Chip package and method of forming a chip package with a metal contact structure and protective layer, and method of forming an electrical contact Joachim Mahler, Michael Bauer, Jochen Dangelmaier, Reimund Engl, Johann Gatterbauer +6 more 2019-10-29
9941181 Chip package and method of forming a chip package Michael Bauer, Reimund Engl, Michael Huettinger, Werner Kanert, Joachim Mahler +1 more 2018-04-10
9543199 Long-term heat treated integrated circuit arrangements and methods for producing the same Oliver Aubel, Wolfgang Hasse, Martina Hommel 2017-01-10
9390973 On-chip RF shields with backside redistribution lines Hans-Joachim Barth, Jens Pohl, Gottfried Beer 2016-07-12
9312172 Semiconductor device and method for making same Dirk Meinhold, Wolfgang Dickenscheid 2016-04-12
9269669 Process for producing a multifunctional dielectric layer on a substrate Johann Helneder, Markus Schwerd, Thomas Goebel, Andrea Mitchell, Martina Hommel 2016-02-23
9263328 Semiconductor device and method for making same Dirk Meinhold, Wolfgang Dickenscheid 2016-02-16
8994179 Semiconductor device and method for making same Dirk Meinhold, Wolfgang Dickenscheid 2015-03-31
8946074 Method of making interconnect structure 2015-02-03
8889548 On-chip RF shields with backside redistribution lines Hans-Joachim Barth, Jens Pohl, Gottfried Beer 2014-11-18
8748287 System on a chip with on-chip RF shield Hans-Joachim Barth, Andre Hanke, Snezana Jenei, Oliver Nagy, Jiro Morinaga +1 more 2014-06-10
8643183 Long-term heat-treated integrated circuit arrangements and methods for producing the same Oliver Aubel, Wolfgang Hasse, Martina Hommel 2014-02-04
8536683 System on a chip with on-chip RF shield Hans-Joachim Barth, Andre Hanke, Snezana Jenei, Oliver Nagy, Jiro Morinaga +1 more 2013-09-17
8258628 System and method for integrated circuit arrangement having a plurality of conductive structure levels Martina Hommel, Markus Schwerd, Martin Seck 2012-09-04
8063469 On-chip radio frequency shield with interconnect metallization Hans-Joachim Barth, Thorsten Meyer, Markus Brunnbauer 2011-11-22
8049336 Interconnect structure 2011-11-01
7960832 Integrated circuit arrangement with layer stack 2011-06-14
7948064 System on a chip with on-chip RF shield Hans-Joachim Barth, Andre Hanke, Snezana Jenei, Oliver Nagy, Jiro Morinaga +1 more 2011-05-24
7936052 On-chip RF shields with backside redistribution lines Hans-Joachim Barth, Jens Pohl, Gottfried Beer 2011-05-03
7667256 Integrated circuit arrangement having a plurality of conductive structure levels and capacitor, and a method for producing the integrated circuit arrangement Martina Hommel, Markus Schwerd, Martin Seck 2010-02-23