Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9627317 | Wafer with improved plating current distribution | Thomas Werner, Frank Feustel | 2017-04-18 |
| 9543199 | Long-term heat treated integrated circuit arrangements and methods for producing the same | Wolfgang Hasse, Martina Hommel, Heinrich Koerner | 2017-01-10 |
| 9455232 | Semiconductor structure including a die seal leakage detection material, method for the formation thereof and method including a test of a semiconductor structure | Thomas Werner, Frank Feustel | 2016-09-27 |
| 9362239 | Vertical breakdown protection layer | Georg Talut, Thomas Werner | 2016-06-07 |
| 9349641 | Wafer with improved plating current distribution | Thomas Werner, Frank Feustel | 2016-05-24 |
| 8653624 | Semiconductor device comprising metal-based eFuses of enhanced programming efficiency by enhancing metal agglomeration and/or voiding | Christian Hennesthal, Jens Poppe, Holger Pagel, Andreas Kurz | 2014-02-18 |
| 8643183 | Long-term heat-treated integrated circuit arrangements and methods for producing the same | Wolfgang Hasse, Martina Hommel, Heinrich Koerner | 2014-02-04 |
| 8314625 | Built-in compliance in test structures for leakage and dielectric breakdown of dielectric materials of metallization systems of semiconductor devices | Frank Feustel, Torsten Schmidt | 2012-11-20 |
| 8268679 | Semiconductor device comprising eFUSES of enhanced programming efficiency | Jens Poppe, Andreas Kurz, Roman Boschke | 2012-09-18 |
| 8174010 | Unified test structure for stress migration tests | Frank Feustel, Pascal Limbecker | 2012-05-08 |
| 8153524 | Providing superior electromigration performance and reducing deterioration of sensitive low-k dielectrics in metallization systems of semiconductor devices | Joerg Hohage, Frank Feustel, Axel Preusse | 2012-04-10 |
| 7512506 | IC chip stress testing | Tom C. Lee, Deborah M. Massey, Travis S. Merrill, Stanley W. Polchlopek, Alvin W. Strong +1 more | 2009-03-31 |