Issued Patents All Time
Showing 25 most recent of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9620453 | Semiconductor structure including a layer of a first metal between a diffusion barrier layer and a second metal and method for the formation thereof | Romy Liske, Marcus Wislicenus, Robert F. Krause, Lukas Gerlich, Benjamin Uhlig +1 more | 2017-04-11 |
| 9305878 | Integrated circuits and methods for fabricating integrated circuits with capping layers between metal contacts and interconnects | Torsten Huisinga, Carsten Peters, Andreas Ott | 2016-04-05 |
| 8951900 | Contact elements of a semiconductor device formed by electroless plating and excess material removal with reduced sheer forces | Norbert Schroeder, Uwe Stoeckgen | 2015-02-10 |
| 8932911 | Integrated circuits and methods for fabricating integrated circuits with capping layers between metal contacts and interconnects | Torsten Huisinga, Carsten Peters, Andreas Ott | 2015-01-13 |
| 8883610 | Microstructure device including a metallization structure with self-aligned air gaps between closely spaced metal lines | Robert Seidel, Markus Nopper | 2014-11-11 |
| 8450197 | Contact elements of a semiconductor device formed by electroless plating and excess material removal with reduced sheer forces | Norbert Schroeder, Uwe Stoeckgen | 2013-05-28 |
| 8389401 | Contact elements of semiconductor devices formed on the basis of a partially applied activation layer | Robert Seidel, Markus Nopper | 2013-03-05 |
| 8314494 | Metal cap layer of increased electrode potential for copper-based metal regions in semiconductor devices | Markus Nopper, Robert Seidel | 2012-11-20 |
| 8153524 | Providing superior electromigration performance and reducing deterioration of sensitive low-k dielectrics in metallization systems of semiconductor devices | Oliver Aubel, Joerg Hohage, Frank Feustel | 2012-04-10 |
| 7985329 | Technique for electrochemically depositing an alloy having a chemical order | Gerd Marxsen | 2011-07-26 |
| 7981793 | Method of forming a metal directly on a conductive barrier layer by electrochemical deposition using an oxygen-depleted ambient | Charlotte Emnet, Susanne Wehner | 2011-07-19 |
| 7947158 | Apparatus and method for removing bubbles from a process liquid | Helge Hartz, Markus Nopper | 2011-05-24 |
| 7781329 | Reducing leakage in dielectric materials including metal regions including a metal cap layer in semiconductor devices | Markus Nopper, Thomas Ortleb, Juergen Boemmels | 2010-08-24 |
| 7745327 | Method of forming a copper-based metallization layer including a conductive cap layer by an advanced integration regime | Michael Friedemann, Robert Seidel, Berit Freudenberg | 2010-06-29 |
| 7615103 | Apparatus and method for removing bubbles from a process liquid | Helge Hartz, Markus Nopper | 2009-11-10 |
| 7560381 | Technique for metal deposition by electroless plating using an activation scheme including a substrate heating process | Markus Nopper, Matthias Bonkass | 2009-07-14 |
| 7517782 | Method of forming a metal layer over a patterned dielectric by wet chemical deposition including an electroless and a powered phase | Susanne Wehner, Markus Nopper | 2009-04-14 |
| 7476552 | Method of reworking a semiconductor structure | Uwe Stoeckgen, Markus Nopper | 2009-01-13 |
| 7375031 | Technique for forming interconnect structures with reduced electro and stress migration and/or resistivity | Markus Keil, Wolfgang Buchholtz, Petra Hetzer, Elvira Buchholtz | 2008-05-20 |
| 7169664 | Method of reducing wafer contamination by removing under-metal layers at the wafer edge | Markus Nopper, Holger Schührer | 2007-01-30 |
| 6974530 | Method and system for controlling ion distribution during plating of a metal on a workpiece surface | Matthias Bonkass | 2005-12-13 |
| 6958247 | Method of electroplating copper over a patterned dielectric layer to enhance process uniformity of a subsequent CMP process | Gerd Marxsen, Markus Nopper, Frank Mauersberger | 2005-10-25 |
| 6951816 | Method of forming a metal layer over patterned dielectric by electroless deposition using a catalyst | Markus Nopper | 2005-10-04 |
| 6841056 | Apparatus and method for treating a substrate electrochemically while reducing metal corrosion | — | 2005-01-11 |
| 6774030 | Method and system for improving the manufacturing of metal damascene structures | Gerd Marxsen | 2004-08-10 |