| 9620453 |
Semiconductor structure including a layer of a first metal between a diffusion barrier layer and a second metal and method for the formation thereof |
Romy Liske, Marcus Wislicenus, Robert F. Krause, Lukas Gerlich, Benjamin Uhlig +1 more |
2017-04-11 |
$14,156,000 |
| 9305878 |
Integrated circuits and methods for fabricating integrated circuits with capping layers between metal contacts and interconnects |
Torsten Huisinga, Carsten Peters, Andreas Ott |
2016-04-05 |
$1,295,000 |
| 8951900 |
Contact elements of a semiconductor device formed by electroless plating and excess material removal with reduced sheer forces |
Norbert Schroeder, Uwe Stoeckgen |
2015-02-10 |
$2,183,000 |
| 8932911 |
Integrated circuits and methods for fabricating integrated circuits with capping layers between metal contacts and interconnects |
Torsten Huisinga, Carsten Peters, Andreas Ott |
2015-01-13 |
$1,493,000 |
| 8883610 |
Microstructure device including a metallization structure with self-aligned air gaps between closely spaced metal lines |
Robert Seidel, Markus Nopper |
2014-11-11 |
$1,428,000 |
| 8450197 |
Contact elements of a semiconductor device formed by electroless plating and excess material removal with reduced sheer forces |
Norbert Schroeder, Uwe Stoeckgen |
2013-05-28 |
$3,942,000 |
| 8389401 |
Contact elements of semiconductor devices formed on the basis of a partially applied activation layer |
Robert Seidel, Markus Nopper |
2013-03-05 |
$2,179,000 |
| 8314494 |
Metal cap layer of increased electrode potential for copper-based metal regions in semiconductor devices |
Markus Nopper, Robert Seidel |
2012-11-20 |
$2,815,000 |
| 8153524 |
Providing superior electromigration performance and reducing deterioration of sensitive low-k dielectrics in metallization systems of semiconductor devices |
Oliver Aubel, Joerg Hohage, Frank Feustel |
2012-04-10 |
$5,913,000 |
| 7985329 |
Technique for electrochemically depositing an alloy having a chemical order |
Gerd Marxsen |
2011-07-26 |
$4,784,000 |
| 7981793 |
Method of forming a metal directly on a conductive barrier layer by electrochemical deposition using an oxygen-depleted ambient |
Charlotte Emnet, Susanne Wehner |
2011-07-19 |
$3,440,000 |
| 7947158 |
Apparatus and method for removing bubbles from a process liquid |
Helge Hartz, Markus Nopper |
2011-05-24 |
$15,194,000 |
| 7781329 |
Reducing leakage in dielectric materials including metal regions including a metal cap layer in semiconductor devices |
Markus Nopper, Thomas Ortleb, Juergen Boemmels |
2010-08-24 |
$5,281,000 |
| 7745327 |
Method of forming a copper-based metallization layer including a conductive cap layer by an advanced integration regime |
Michael Friedemann, Robert Seidel, Berit Freudenberg |
2010-06-29 |
$10,708,000 |
| 7615103 |
Apparatus and method for removing bubbles from a process liquid |
Helge Hartz, Markus Nopper |
2009-11-10 |
$22,613,000 |
| 7560381 |
Technique for metal deposition by electroless plating using an activation scheme including a substrate heating process |
Markus Nopper, Matthias Bonkass |
2009-07-14 |
$9,035,000 |
| 7517782 |
Method of forming a metal layer over a patterned dielectric by wet chemical deposition including an electroless and a powered phase |
Susanne Wehner, Markus Nopper |
2009-04-14 |
$5,338,000 |
| 7476552 |
Method of reworking a semiconductor structure |
Uwe Stoeckgen, Markus Nopper |
2009-01-13 |
$12,331,000 |
| 7375031 |
Technique for forming interconnect structures with reduced electro and stress migration and/or resistivity |
Markus Keil, Wolfgang Buchholtz, Petra Hetzer, Elvira Buchholtz |
2008-05-20 |
$11,194,000 |
| 7169664 |
Method of reducing wafer contamination by removing under-metal layers at the wafer edge |
Markus Nopper, Holger Schührer |
2007-01-30 |
$15,947,000 |
| 6974530 |
Method and system for controlling ion distribution during plating of a metal on a workpiece surface |
Matthias Bonkass |
2005-12-13 |
$8,414,000 |
| 6958247 |
Method of electroplating copper over a patterned dielectric layer to enhance process uniformity of a subsequent CMP process |
Gerd Marxsen, Markus Nopper, Frank Mauersberger |
2005-10-25 |
$11,546,000 |
| 6951816 |
Method of forming a metal layer over patterned dielectric by electroless deposition using a catalyst |
Markus Nopper |
2005-10-04 |
$16,745,000 |
| 6841056 |
Apparatus and method for treating a substrate electrochemically while reducing metal corrosion |
— |
2005-01-11 |
$4,696,000 |
| 6774030 |
Method and system for improving the manufacturing of metal damascene structures |
Gerd Marxsen |
2004-08-10 |
$1,968,000 |
