Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8883610 | Microstructure device including a metallization structure with self-aligned air gaps between closely spaced metal lines | Robert Seidel, Axel Preusse | 2014-11-11 |
| 8389401 | Contact elements of semiconductor devices formed on the basis of a partially applied activation layer | Robert Seidel, Axel Preusse | 2013-03-05 |
| 8323471 | Automatic deposition profile targeting | Thomas Ortleb, Dirk Wollstein | 2012-12-04 |
| 8314494 | Metal cap layer of increased electrode potential for copper-based metal regions in semiconductor devices | Axel Preusse, Robert Seidel | 2012-11-20 |
| 7947158 | Apparatus and method for removing bubbles from a process liquid | Helge Hartz, Axel Preusse | 2011-05-24 |
| 7899570 | Advanced automatic deposition profile targeting and control by applying advanced polish endpoint system feedback | Thomas Ortleb, Thomas Harold Roessler | 2011-03-01 |
| 7781329 | Reducing leakage in dielectric materials including metal regions including a metal cap layer in semiconductor devices | Axel Preusse, Thomas Ortleb, Juergen Boemmels | 2010-08-24 |
| 7781343 | Semiconductor substrate having a protection layer at the substrate back side | Tobias Letz, Holger Schuehrer | 2010-08-24 |
| 7615103 | Apparatus and method for removing bubbles from a process liquid | Helge Hartz, Axel Preusse | 2009-11-10 |
| 7560381 | Technique for metal deposition by electroless plating using an activation scheme including a substrate heating process | Axel Preusse, Matthias Bonkass | 2009-07-14 |
| 7517782 | Method of forming a metal layer over a patterned dielectric by wet chemical deposition including an electroless and a powered phase | Axel Preusse, Susanne Wehner | 2009-04-14 |
| 7476552 | Method of reworking a semiconductor structure | Axel Preusse, Uwe Stoeckgen | 2009-01-13 |
| 7169664 | Method of reducing wafer contamination by removing under-metal layers at the wafer edge | Axel Preusse, Holger Schührer | 2007-01-30 |
| 6958247 | Method of electroplating copper over a patterned dielectric layer to enhance process uniformity of a subsequent CMP process | Gerd Marxsen, Axel Preusse, Frank Mauersberger | 2005-10-25 |
| 6951816 | Method of forming a metal layer over patterned dielectric by electroless deposition using a catalyst | Axel Preusse | 2005-10-04 |
| 6620726 | Method of forming metal lines having improved uniformity on a substrate | Axel Preusse, Gerd Marxsen | 2003-09-16 |