Markus Nopper — 16 Patents at AMD

Markus Nopper has been granted 16 US patents while listed as an inventor at AMD. The first was granted in 2003 and the most recent in November 2014. Markus Nopper ranks #284,196 of 4,157,543 US inventors in our database (top 6.8%). Patent records list Markus Nopper in Dresden, DE.

Issued Patents All Time

Showing 1–16 of 16 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
8883610	Microstructure device including a metallization structure with self-aligned air gaps between closely spaced metal lines	Robert Seidel, Axel Preusse	2014-11-11	$1,428,000
8389401	Contact elements of semiconductor devices formed on the basis of a partially applied activation layer	Robert Seidel, Axel Preusse	2013-03-05	$2,179,000
8323471	Automatic deposition profile targeting	Thomas Ortleb, Dirk Wollstein	2012-12-04	$1,677,000
8314494	Metal cap layer of increased electrode potential for copper-based metal regions in semiconductor devices	Axel Preusse, Robert Seidel	2012-11-20	$2,815,000
7947158	Apparatus and method for removing bubbles from a process liquid	Helge Hartz, Axel Preusse	2011-05-24	$15,194,000
7899570	Advanced automatic deposition profile targeting and control by applying advanced polish endpoint system feedback	Thomas Ortleb, Thomas Harold Roessler	2011-03-01	$8,863,000
7781329	Reducing leakage in dielectric materials including metal regions including a metal cap layer in semiconductor devices	Axel Preusse, Thomas Ortleb, Juergen Boemmels	2010-08-24	$5,281,000
7781343	Semiconductor substrate having a protection layer at the substrate back side	Tobias Letz, Holger Schuehrer	2010-08-24	$5,281,000
7615103	Apparatus and method for removing bubbles from a process liquid	Helge Hartz, Axel Preusse	2009-11-10	$22,613,000
7560381	Technique for metal deposition by electroless plating using an activation scheme including a substrate heating process	Axel Preusse, Matthias Bonkass	2009-07-14	$9,035,000
7517782	Method of forming a metal layer over a patterned dielectric by wet chemical deposition including an electroless and a powered phase	Axel Preusse, Susanne Wehner	2009-04-14	$5,338,000
7476552	Method of reworking a semiconductor structure	Axel Preusse, Uwe Stoeckgen	2009-01-13	$12,331,000
7169664	Method of reducing wafer contamination by removing under-metal layers at the wafer edge	Axel Preusse, Holger Schührer	2007-01-30	$15,947,000
6958247	Method of electroplating copper over a patterned dielectric layer to enhance process uniformity of a subsequent CMP process	Gerd Marxsen, Axel Preusse, Frank Mauersberger	2005-10-25	$11,546,000
6951816	Method of forming a metal layer over patterned dielectric by electroless deposition using a catalyst	Axel Preusse	2005-10-04	$16,745,000
6620726	Method of forming metal lines having improved uniformity on a substrate	Axel Preusse, Gerd Marxsen	2003-09-16	$3,735,000

Markus Nopper — 16 Patents

Issued Patents All Time

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