Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8383500 | Semiconductor device formed by a replacement gate approach based on an early work function metal | Joachim Metzger, Robert Binder, Markus Lenski | 2013-02-26 |
| 8183139 | Reduced defectivity in contacts of a semiconductor device comprising replacement gate electrode structures by using an intermediate cap layer | Jens Heinrich | 2012-05-22 |
| 8182709 | CMP system and method using individually controlled temperature zones | Jens Heinrich | 2012-05-22 |
| 8152595 | System and method for optical endpoint detection during CMP by using an across-substrate signal | Mike Schlicker | 2012-04-10 |
| 8138038 | Superior fill conditions in a replacement gate approach by performing a polishing process based on a sacrificial fill material | Jens Heinrich, Katja Steffen | 2012-03-20 |
| 7985329 | Technique for electrochemically depositing an alloy having a chemical order | Axel Preusse | 2011-07-26 |
| 7905764 | Polishing head using zone control | Jens Heinrich | 2011-03-15 |
| 7268000 | Method and system for controlling the chemical mechanical polishing of substrates by calculating an overpolishing time and/or a polishing time of a final polishing step | Dirk Wollstein, Jan Raebiger | 2007-09-11 |
| 6958247 | Method of electroplating copper over a patterned dielectric layer to enhance process uniformity of a subsequent CMP process | Axel Preusse, Markus Nopper, Frank Mauersberger | 2005-10-25 |
| 6957997 | Method and system for controlling the chemical mechanical polishing by using a sensor signal of a pad conditioner | Jens Kramer, Uwe Günter | 2005-10-25 |
| 6774030 | Method and system for improving the manufacturing of metal damascene structures | Axel Preusse | 2004-08-10 |
| 6761812 | Apparatus and method for electrochemical metal deposition | Axel Preusse | 2004-07-13 |
| 6752697 | Apparatus and method for chemical mechanical polishing of a substrate | Uwe Stoeckgen | 2004-06-22 |
| 6746958 | Method of controlling the duration of an endpoint polishing process in a multistage polishing process | Joyce S. Oey Hewett, Anthony J. Toprac | 2004-06-08 |
| 6720264 | Prevention of precipitation defects on copper interconnects during CMP by use of solutions containing organic compounds with silica adsorption and copper corrosion inhibiting properties | Kashmir Sahota, Diana M. Schonauer, Johannes Groschopf, Steven C. Avanzino | 2004-04-13 |
| 6699107 | Polishing head and apparatus with an improved pad conditioner for chemical mechanical polishing | Uwe Stoeckgen | 2004-03-02 |
| 6620726 | Method of forming metal lines having improved uniformity on a substrate | Axel Preusse, Markus Nopper | 2003-09-16 |
| 6595830 | Method of controlling chemical mechanical polishing operations to control erosion of insulating materials | Joyce S. Oey Hewett, Anthony J. Toprac | 2003-07-22 |
| 6184141 | Method for multiple phase polishing of a conductive layer in a semidonductor wafer | Steven C. Avanzino, Kashmir Sahota | 2001-02-06 |