| 8383500 |
Semiconductor device formed by a replacement gate approach based on an early work function metal |
Joachim Metzger, Robert Binder, Markus Lenski |
2013-02-26 |
| 8183139 |
Reduced defectivity in contacts of a semiconductor device comprising replacement gate electrode structures by using an intermediate cap layer |
Jens Heinrich |
2012-05-22 |
| 8182709 |
CMP system and method using individually controlled temperature zones |
Jens Heinrich |
2012-05-22 |
| 8152595 |
System and method for optical endpoint detection during CMP by using an across-substrate signal |
Mike Schlicker |
2012-04-10 |
| 8138038 |
Superior fill conditions in a replacement gate approach by performing a polishing process based on a sacrificial fill material |
Jens Heinrich, Katja Steffen |
2012-03-20 |
| 7985329 |
Technique for electrochemically depositing an alloy having a chemical order |
Axel Preusse |
2011-07-26 |
| 7905764 |
Polishing head using zone control |
Jens Heinrich |
2011-03-15 |
| 7268000 |
Method and system for controlling the chemical mechanical polishing of substrates by calculating an overpolishing time and/or a polishing time of a final polishing step |
Dirk Wollstein, Jan Raebiger |
2007-09-11 |
| 6958247 |
Method of electroplating copper over a patterned dielectric layer to enhance process uniformity of a subsequent CMP process |
Axel Preusse, Markus Nopper, Frank Mauersberger |
2005-10-25 |
| 6957997 |
Method and system for controlling the chemical mechanical polishing by using a sensor signal of a pad conditioner |
Jens Kramer, Uwe Günter |
2005-10-25 |
| 6774030 |
Method and system for improving the manufacturing of metal damascene structures |
Axel Preusse |
2004-08-10 |
| 6761812 |
Apparatus and method for electrochemical metal deposition |
Axel Preusse |
2004-07-13 |
| 6752697 |
Apparatus and method for chemical mechanical polishing of a substrate |
Uwe Stoeckgen |
2004-06-22 |
| 6746958 |
Method of controlling the duration of an endpoint polishing process in a multistage polishing process |
Joyce S. Oey Hewett, Anthony J. Toprac |
2004-06-08 |
| 6720264 |
Prevention of precipitation defects on copper interconnects during CMP by use of solutions containing organic compounds with silica adsorption and copper corrosion inhibiting properties |
Kashmir Sahota, Diana M. Schonauer, Johannes Groschopf, Steven C. Avanzino |
2004-04-13 |
| 6699107 |
Polishing head and apparatus with an improved pad conditioner for chemical mechanical polishing |
Uwe Stoeckgen |
2004-03-02 |
| 6620726 |
Method of forming metal lines having improved uniformity on a substrate |
Axel Preusse, Markus Nopper |
2003-09-16 |
| 6595830 |
Method of controlling chemical mechanical polishing operations to control erosion of insulating materials |
Joyce S. Oey Hewett, Anthony J. Toprac |
2003-07-22 |
| 6184141 |
Method for multiple phase polishing of a conductive layer in a semidonductor wafer |
Steven C. Avanzino, Kashmir Sahota |
2001-02-06 |
