Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8748302 | Replacement gate approach for high-k metal gate stacks by using a multi-layer contact level | Christopher M. Prindle, Andreas Ott | 2014-06-10 |
| 8679924 | Self-aligned multiple gate transistor formed on a bulk substrate | Andy Wei, Vivien Schroeder, Thilo Scheiper, Thomas Werner | 2014-03-25 |
| 8585465 | Planarization of a material system in a semiconductor device by using a non-selective in situ prepared slurry | Rico Hueselitz, Marco Kitsche, Katja Steffen | 2013-11-19 |
| 8506770 | Electrochemical planarization system comprising enhanced electrolyte flow | Axel Kiesel | 2013-08-13 |
| 8357575 | Technique for exposing a placeholder material in a replacement gate approach by modifying a removal rate of stressed dielectric overlayers | Klaus Hempel, Patrick Press, Vivien Schroeder, Berthold Reimer | 2013-01-22 |
| 8338306 | Forming semiconductor resistors in a semiconductor device comprising metal gates by increasing etch resistivity of the resistors | Jens Heinrich, Ralf Richter, Katja Steffen, Frank Seliger, Andreas Ott +2 more | 2012-12-25 |
| 8247281 | Technique for exposing a placeholder material in a replacement gate approach by modifying a removal rate of stressed dielectric overlayers | Klaus Hempel, Patrick Press, Vivien Schroeder, Berthold Reimer | 2012-08-21 |
| 8021942 | Method of forming CMOS device having gate insulation layers of different type and thickness | Andy Wei, Andrew Waite, Martin Trentzsch, Gunter Grasshoff, Andreas Ott | 2011-09-20 |
| 7767508 | Method for forming offset spacers for semiconductor device arrangements | Philip A. Fisher, Laura A. Brown, Huicai Zhong | 2010-08-03 |
| 7528059 | Method for reducing polish-induced damage in a contact structure by forming a capping layer | Kai Frohberg, Sandra Bau | 2009-05-05 |
| 7456105 | CMP metal polishing slurry and process with reduced solids concentration | Kevin Cooper, Jennifer L. Cooper, János Farkas, John C. Flake, Yuri Solomentsev | 2008-11-25 |
| 7387970 | Method of using an aqueous solution and composition thereof | Kevin Cooper, John C. Flake, Yuri Solomentsev | 2008-06-17 |
| 7223698 | Method of forming a semiconductor arrangement with reduced field-to active step height | Douglas J. Bonser, Srikanteswara Dakshina-Murthy, Mark Kelling, John G. Pellerin, Edward Asuka Nomura | 2007-05-29 |
| 7091106 | Method of reducing STI divot formation during semiconductor device fabrication | Douglas J. Bonser, Srikanteswara Dakshina-Murthy, John G. Pellerin, Jon D. Cheek | 2006-08-15 |
| 6720242 | Method of forming a substrate contact in a field effect transistor formed over a buried insulator layer | Gert Burbach, Frank Heinlein, Gotthard Jungnickel, Hartmut Ruelke, Carsten Hartig | 2004-04-13 |
| 6720264 | Prevention of precipitation defects on copper interconnects during CMP by use of solutions containing organic compounds with silica adsorption and copper corrosion inhibiting properties | Kashmir Sahota, Diana M. Schonauer, Gerd Marxsen, Steven C. Avanzino | 2004-04-13 |