Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10115621 | Method for in-die overlay control using FEOL dummy fill layer | Peter Moll, Martin Schmidt, Matthias Ruhm, Stefan Thierbach, Stefan Rongen +3 more | 2018-10-30 |
| 9177873 | Systems and methods for fabricating semiconductor device structures | Alok Vaid, Lokesh Subramany | 2015-11-03 |
| 9171765 | Inline residual layer detection and characterization post via post etch using CD-SEM | Daniel Fischer | 2015-10-27 |
| 9091667 | Detection of particle contamination on wafers | Adam Michal Urbanowicz, Daniel Fischer | 2015-07-28 |
| 9029855 | Layout for reticle and wafer scanning electron microscope registration or overlay measurements | Guo Xiang Ning, Paul Ackmann, Fanghong Gn | 2015-05-12 |
| 8892237 | Systems and methods for fabricating semiconductor device structures using different metrology tools | Alok Vaid | 2014-11-18 |
| 7663766 | Incorporating film optical property measurements into scatterometry metrology | Jason P. Cain | 2010-02-16 |
| 7410885 | Method of reducing contamination by removing an interlayer dielectric from the substrate edge | Holger Schuehrer, Christin Bartsch | 2008-08-12 |
| 7259091 | Technique for forming a passivation layer prior to depositing a barrier layer in a copper metallization layer | Holger Schuehrer, Christin Bartsch, Kai Frohberg | 2007-08-21 |
| 7098140 | Method of compensating for etch rate non-uniformities by ion implantation | Matthias Schaller, Christoph Schwan | 2006-08-29 |
| 6936383 | Method of defining the dimensions of circuit elements by using spacer deposition techniques | Martin Mazur, Georg Sulzer | 2005-08-30 |
| 6838010 | System and method for wafer-based controlled patterning of features with critical dimensions | Gunter Grasshoff | 2005-01-04 |
| 6724096 | Die corner alignment structure | Thomas Werner, Gunter Grasshoff, Bernd Schulz | 2004-04-20 |
| 6720242 | Method of forming a substrate contact in a field effect transistor formed over a buried insulator layer | Gert Burbach, Frank Heinlein, Johannes Groschopf, Gotthard Jungnickel, Hartmut Ruelke | 2004-04-13 |