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Method for in-die overlay control using FEOL dummy fill layer |
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2018-10-30 |
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Systems and methods for fabricating semiconductor device structures |
Alok Vaid, Lokesh Subramany |
2015-11-03 |
| 9171765 |
Inline residual layer detection and characterization post via post etch using CD-SEM |
Daniel Fischer |
2015-10-27 |
| 9091667 |
Detection of particle contamination on wafers |
Adam Michal Urbanowicz, Daniel Fischer |
2015-07-28 |
| 9029855 |
Layout for reticle and wafer scanning electron microscope registration or overlay measurements |
Guo Xiang Ning, Paul Ackmann, Fanghong Gn |
2015-05-12 |
| 8892237 |
Systems and methods for fabricating semiconductor device structures using different metrology tools |
Alok Vaid |
2014-11-18 |
| 7663766 |
Incorporating film optical property measurements into scatterometry metrology |
Jason P. Cain |
2010-02-16 |
| 7410885 |
Method of reducing contamination by removing an interlayer dielectric from the substrate edge |
Holger Schuehrer, Christin Bartsch |
2008-08-12 |
| 7259091 |
Technique for forming a passivation layer prior to depositing a barrier layer in a copper metallization layer |
Holger Schuehrer, Christin Bartsch, Kai Frohberg |
2007-08-21 |
| 7098140 |
Method of compensating for etch rate non-uniformities by ion implantation |
Matthias Schaller, Christoph Schwan |
2006-08-29 |
| 6936383 |
Method of defining the dimensions of circuit elements by using spacer deposition techniques |
Martin Mazur, Georg Sulzer |
2005-08-30 |
| 6838010 |
System and method for wafer-based controlled patterning of features with critical dimensions |
Gunter Grasshoff |
2005-01-04 |
| 6724096 |
Die corner alignment structure |
Thomas Werner, Gunter Grasshoff, Bernd Schulz |
2004-04-20 |
| 6720242 |
Method of forming a substrate contact in a field effect transistor formed over a buried insulator layer |
Gert Burbach, Frank Heinlein, Johannes Groschopf, Gotthard Jungnickel, Hartmut Ruelke |
2004-04-13 |