Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8673087 | Reducing copper defects during a wet chemical cleaning of exposed copper surfaces in a metallization layer of a semiconductor device | Frank Feustel, Tobias Letz, Andreas Ott | 2014-03-18 |
| 8664115 | Copper interconnect with metal hardmask removal | Susanne Leppack | 2014-03-04 |
| 8423320 | Method and system for quantitative inline material characterization in semiconductor production processes based on structural measurements and related models | Matthias Schaller, Thomas Oszinda, Daniel Fischer | 2013-04-16 |
| 8338293 | Method of reducing erosion of a metal cap layer during via patterning in semiconductor devices | Daniel Fischer, Matthias Schaller | 2012-12-25 |
| 7986040 | Method of reducing erosion of a metal cap layer during via patterning in semiconductor devices | Daniel Fischer, Matthias Schaller | 2011-07-26 |
| 7410885 | Method of reducing contamination by removing an interlayer dielectric from the substrate edge | Holger Schuehrer, Carsten Hartig | 2008-08-12 |
| 7259091 | Technique for forming a passivation layer prior to depositing a barrier layer in a copper metallization layer | Holger Schuehrer, Carsten Hartig, Kai Frohberg | 2007-08-21 |