Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8859398 | Enhancing adhesion of interlayer dielectric materials of semiconductor devices by suppressing silicide formation at the substrate edge | Frank Feustel, Kai Frohberg | 2014-10-14 |
| 8841140 | Technique for forming a passivation layer without a terminal metal | Matthias Lehr, Joerg Hohage, Frank Kuechenmeister | 2014-09-23 |
| 8673087 | Reducing copper defects during a wet chemical cleaning of exposed copper surfaces in a metallization layer of a semiconductor device | Frank Feustel, Christin Bartsch, Andreas Ott | 2014-03-18 |
| 8426312 | Method of reducing contamination by providing an etch stop layer at the substrate edge | Ralf Richter, Holger Schuehrer | 2013-04-23 |
| 8323989 | Test system and method of reducing damage in seed layers in metallization systems of semiconductor devices | Frank Feustel, Frank Koschinsky | 2012-12-04 |
| 8193086 | Local silicidation of via bottoms in metallization systems of semiconductor devices | Frank Feustel | 2012-06-05 |
| 7924569 | Semiconductor device comprising an in-chip active heat transfer system | — | 2011-04-12 |
| 7879709 | Semiconductor structure comprising an electrically conductive feature and method of forming a semiconductor structure | Frank Feustel, Carsten Peters | 2011-02-01 |
| 7820536 | Method for removing a passivation layer prior to depositing a barrier layer in a copper metallization layer | Holger Schuehrer, Frank Koschinsky | 2010-10-26 |
| 7781343 | Semiconductor substrate having a protection layer at the substrate back side | Holger Schuehrer, Markus Nopper | 2010-08-24 |