Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10090195 | Method including a formation of a diffusion barrier and semiconductor structure including a diffusion barrier | Bernd Hintze, Heiko Weber | 2018-10-02 |
| 9177858 | Methods for fabricating integrated circuits including barrier layers for interconnect structures | Xunyuan Zhang, Tibor Bolom, Kun Ho Ahn, Bernd Hintze | 2015-11-03 |
| 9177826 | Methods of forming metal nitride materials | Bernd Hintze | 2015-11-03 |
| 9171754 | Method including an etching of a portion of an interlayer dielectric in a semiconductor structure, a degas process and a preclean process | Bernd Hintze, Oliver Witnik | 2015-10-27 |
| 9147618 | Method for detecting defects in a diffusion barrier layer | Bernd Hintze, Dirk Utess | 2015-09-29 |
| 8585877 | Multi-step deposition control | Roland Jaeger, Frank Wagenbreth | 2013-11-19 |
| 8323989 | Test system and method of reducing damage in seed layers in metallization systems of semiconductor devices | Frank Feustel, Tobias Letz | 2012-12-04 |
| 8163571 | Multi-step deposition control | Roland Jaeger, Frank Wagenbreth | 2012-04-24 |
| 8058081 | Method of testing an integrity of a material layer in a semiconductor structure | Moritz Andreas Meyer, Eckhard Langer | 2011-11-15 |
| 8053354 | Reduced wafer warpage in semiconductors by stress engineering in the metallization system | Matthias Lehr, Joerg Hohage | 2011-11-08 |
| 8039400 | Reducing contamination of semiconductor substrates during BEOL processing by performing a deposition/etch cycle during barrier deposition | Matthias Lehr, Holger Schuehrer | 2011-10-18 |
| 7820536 | Method for removing a passivation layer prior to depositing a barrier layer in a copper metallization layer | Holger Schuehrer, Tobias Letz | 2010-10-26 |
| 7063091 | Method for cleaning the surface of a substrate | Volker Kahlert, Peter Huebler | 2006-06-20 |
| 6964874 | Void formation monitoring in a damascene process | Thomas Werner, Peter Hübler | 2005-11-15 |
| 6716650 | Interface void monitoring in a damascene process | Eckhard Langer, Volker Kahlert, Peter Hübler | 2004-04-06 |
| 6613660 | Metallization process sequence for a barrier metal layer | Volker Kahlert, Peter Hübler | 2003-09-02 |