| 10090195 |
Method including a formation of a diffusion barrier and semiconductor structure including a diffusion barrier |
Bernd Hintze, Heiko Weber |
2018-10-02 |
| 9177858 |
Methods for fabricating integrated circuits including barrier layers for interconnect structures |
Xunyuan Zhang, Tibor Bolom, Kun Ho Ahn, Bernd Hintze |
2015-11-03 |
| 9177826 |
Methods of forming metal nitride materials |
Bernd Hintze |
2015-11-03 |
| 9171754 |
Method including an etching of a portion of an interlayer dielectric in a semiconductor structure, a degas process and a preclean process |
Bernd Hintze, Oliver Witnik |
2015-10-27 |
| 9147618 |
Method for detecting defects in a diffusion barrier layer |
Bernd Hintze, Dirk Utess |
2015-09-29 |
| 8585877 |
Multi-step deposition control |
Roland Jaeger, Frank Wagenbreth |
2013-11-19 |
| 8323989 |
Test system and method of reducing damage in seed layers in metallization systems of semiconductor devices |
Frank Feustel, Tobias Letz |
2012-12-04 |
| 8163571 |
Multi-step deposition control |
Roland Jaeger, Frank Wagenbreth |
2012-04-24 |
| 8058081 |
Method of testing an integrity of a material layer in a semiconductor structure |
Moritz Andreas Meyer, Eckhard Langer |
2011-11-15 |
| 8053354 |
Reduced wafer warpage in semiconductors by stress engineering in the metallization system |
Matthias Lehr, Joerg Hohage |
2011-11-08 |
| 8039400 |
Reducing contamination of semiconductor substrates during BEOL processing by performing a deposition/etch cycle during barrier deposition |
Matthias Lehr, Holger Schuehrer |
2011-10-18 |
| 7820536 |
Method for removing a passivation layer prior to depositing a barrier layer in a copper metallization layer |
Holger Schuehrer, Tobias Letz |
2010-10-26 |
| 7063091 |
Method for cleaning the surface of a substrate |
Volker Kahlert, Peter Huebler |
2006-06-20 |
| 6964874 |
Void formation monitoring in a damascene process |
Thomas Werner, Peter Hübler |
2005-11-15 |
| 6716650 |
Interface void monitoring in a damascene process |
Eckhard Langer, Volker Kahlert, Peter Hübler |
2004-04-06 |
| 6613660 |
Metallization process sequence for a barrier metal layer |
Volker Kahlert, Peter Hübler |
2003-09-02 |
