Frank Koschinsky — 16 Patents at AMD

Frank Koschinsky has been granted 16 US patents while listed as an inventor at AMD. The first was granted in 2003 and the most recent in October 2018. Frank Koschinsky ranks #284,196 of 4,157,543 US inventors in our database (top 6.8%). Patent records list Frank Koschinsky in Radebeul, DE.

Issued Patents All Time

Showing 1–16 of 16 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
10090195	Method including a formation of a diffusion barrier and semiconductor structure including a diffusion barrier	Bernd Hintze, Heiko Weber	2018-10-02	$17,112,000
9177858	Methods for fabricating integrated circuits including barrier layers for interconnect structures	Xunyuan Zhang, Tibor Bolom, Kun Ho Ahn, Bernd Hintze	2015-11-03	$718,000
9177826	Methods of forming metal nitride materials	Bernd Hintze	2015-11-03	$718,000
9171754	Method including an etching of a portion of an interlayer dielectric in a semiconductor structure, a degas process and a preclean process	Bernd Hintze, Oliver Witnik	2015-10-27	$712,000
9147618	Method for detecting defects in a diffusion barrier layer	Bernd Hintze, Dirk Utess	2015-09-29	$1,017,000
8585877	Multi-step deposition control	Roland Jaeger, Frank Wagenbreth	2013-11-19	$2,505,000
8323989	Test system and method of reducing damage in seed layers in metallization systems of semiconductor devices	Frank Feustel, Tobias Letz	2012-12-04	$1,677,000
8163571	Multi-step deposition control	Roland Jaeger, Frank Wagenbreth	2012-04-24	$12,212,000
8058081	Method of testing an integrity of a material layer in a semiconductor structure	Moritz Andreas Meyer, Eckhard Langer	2011-11-15	$6,438,000
8053354	Reduced wafer warpage in semiconductors by stress engineering in the metallization system	Matthias Lehr, Joerg Hohage	2011-11-08	$4,445,000
8039400	Reducing contamination of semiconductor substrates during BEOL processing by performing a deposition/etch cycle during barrier deposition	Matthias Lehr, Holger Schuehrer	2011-10-18	$1,986,000
7820536	Method for removing a passivation layer prior to depositing a barrier layer in a copper metallization layer	Holger Schuehrer, Tobias Letz	2010-10-26	$18,913,000
7063091	Method for cleaning the surface of a substrate	Volker Kahlert, Peter Huebler	2006-06-20	$7,818,000
6964874	Void formation monitoring in a damascene process	Thomas Werner, Peter Hübler	2005-11-15	$25,400,000
6716650	Interface void monitoring in a damascene process	Eckhard Langer, Volker Kahlert, Peter Hübler	2004-04-06	$3,021,000
6613660	Metallization process sequence for a barrier metal layer	Volker Kahlert, Peter Hübler	2003-09-02	$4,831,000

Frank Koschinsky — 16 Patents

Issued Patents All Time

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