| 8575029 |
Technique for forming metal lines in a semiconductor by adapting the temperature dependence of the line resistance |
Moritz Andreas Meyer, Matthias Lehr |
2013-11-05 |
| 8329577 |
Method of forming an alloy in an interconnect structure to increase electromigration resistance |
Matthias Lehr, Moritz Andreas Meyer |
2012-12-11 |
| 8118932 |
Technique for monitoring dynamic processes in metal lines of microstructures |
Joerg Buschbeck, Marco Grafe |
2012-02-21 |
| 8058081 |
Method of testing an integrity of a material layer in a semiconductor structure |
Moritz Andreas Meyer, Frank Koschinsky |
2011-11-15 |
| 8058731 |
Technique for forming metal lines in a semiconductor by adapting the temperature dependence of the line resistance |
Moritz Andreas Meyer, Matthias Lehr |
2011-11-15 |
| 7611991 |
Technique for increasing adhesion of metallization layers by providing dummy vias |
Ralf Richter, Matthias Schaller, Ellen Claus |
2009-11-03 |
| 7335880 |
Technique for CD measurement on the basis of area fraction determination |
Moritz Andreas Meyer |
2008-02-26 |
| 7311008 |
Semiconductor structure comprising a stress sensitive element and method of measuring a stress in a semiconductor structure |
Ehrenfried Zschech |
2007-12-25 |
| 6953755 |
Technique for monitoring the state of metal lines in microstructures |
Moritz Andreas Meyer, Ehrenfried Zschech |
2005-10-11 |
| 6716650 |
Interface void monitoring in a damascene process |
Frank Koschinsky, Volker Kahlert, Peter Hübler |
2004-04-06 |
