Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8575029 | Technique for forming metal lines in a semiconductor by adapting the temperature dependence of the line resistance | Moritz Andreas Meyer, Matthias Lehr | 2013-11-05 |
| 8329577 | Method of forming an alloy in an interconnect structure to increase electromigration resistance | Matthias Lehr, Moritz Andreas Meyer | 2012-12-11 |
| 8118932 | Technique for monitoring dynamic processes in metal lines of microstructures | Joerg Buschbeck, Marco Grafe | 2012-02-21 |
| 8058081 | Method of testing an integrity of a material layer in a semiconductor structure | Moritz Andreas Meyer, Frank Koschinsky | 2011-11-15 |
| 8058731 | Technique for forming metal lines in a semiconductor by adapting the temperature dependence of the line resistance | Moritz Andreas Meyer, Matthias Lehr | 2011-11-15 |
| 7611991 | Technique for increasing adhesion of metallization layers by providing dummy vias | Ralf Richter, Matthias Schaller, Ellen Claus | 2009-11-03 |
| 7335880 | Technique for CD measurement on the basis of area fraction determination | Moritz Andreas Meyer | 2008-02-26 |
| 7311008 | Semiconductor structure comprising a stress sensitive element and method of measuring a stress in a semiconductor structure | Ehrenfried Zschech | 2007-12-25 |
| 6953755 | Technique for monitoring the state of metal lines in microstructures | Moritz Andreas Meyer, Ehrenfried Zschech | 2005-10-11 |
| 6716650 | Interface void monitoring in a damascene process | Frank Koschinsky, Volker Kahlert, Peter Hübler | 2004-04-06 |