Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of forming an alloy in an interconnect structure to increase electromigration resistance

Method of forming an alloy in an interconnect structure to increase electromigration resistance

US Patent 8329577 · Granted Dec 11, 2012

Estimated economic value: $1,376,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Integral gas-introduction and stirring unit for gas-liquid reactors2025
Recommendation non-transitory computer-readable medium, method, and system for m2024
Method for controlling a hydrodynamic machine and hydrodynamic machine2023
Edge configuration of software systems for manufacturing2020
Emerging issue detection and analysis2020
Semiconductor device comprising a die seal including long via lines2020
Semiconductor device comprising a die seal including long via lines2018
Metal line layout based on line shifting2018
Metal line layout based on line shifting2018
Self service propagation of custom extension fields into web services2016
Integrated circuits with metal-insulator-metal (MIM) capacitors and methods for 2016
Semiconductor device including a stress buffer material formed above a low-k met2016