Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device including a stress buffer material formed above a low-k metallization system

Semiconductor device including a stress buffer material formed above a low-k metallization system

US Patent 9324631 · Granted Apr 26, 2016

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Recommendation non-transitory computer-readable medium, method, and system for m2024
Method for controlling a hydrodynamic machine and hydrodynamic machine2023
Edge configuration of software systems for manufacturing2020
Emerging issue detection and analysis2020
Semiconductor device comprising a die seal including long via lines2020
Domestic refrigeration device with a coolant circuit, and method for operating a2019
Semiconductor device comprising a die seal including long via lines2018
Metal line layout based on line shifting2018
Self service propagation of custom extension fields into web services2016
Integrated circuits with metal-insulator-metal (MIM) capacitors and methods for 2016
Stable anchors in user interface to support life cycle extensions2016
Semiconductor device with improved metal pillar configuration2015