Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device comprising a die seal including long via lines

Semiconductor device comprising a die seal including long via lines

US Patent 10607947 · Granted Mar 31, 2020

Estimated economic value: $59,042,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Communication system for an aircraft2025
Crackstop structures2025
Recommendation non-transitory computer-readable medium, method, and system for m2024
Crackstop structures2023
Method for controlling a hydrodynamic machine and hydrodynamic machine2023
Back end of the line metal structure and method2021
Crack detecting and monitoring system for an integrated circuit2021
Edge configuration of software systems for manufacturing2020
Emerging issue detection and analysis2020
Semiconductor device with superior crack resistivity in the metallization system2019
Semiconductor device comprising a die seal including long via lines2018
Semiconductor device comprising a die seal including long via lines2018