Issued Patents All Time
Showing 1–25 of 68 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11928716 | Recommendation non-transitory computer-readable medium, method, and system for micro services | Fazlul Hoque | 2024-03-12 |
| 11590947 | Method for controlling a hydrodynamic machine and hydrodynamic machine | Dieter Laukemann | 2023-02-28 |
| 10768946 | Edge configuration of software systems for manufacturing | Mohamed Aly, Abdelrahman Elmeniawy | 2020-09-08 |
| 10713270 | Emerging issue detection and analysis | Fazlul Hoque, Satya Viswanathan, Ebin Thomas Kandathil, Andreas Cardeneo | 2020-07-14 |
| 10607947 | Semiconductor device comprising a die seal including long via lines | Dirk Breuer, Maik Liebau | 2020-03-31 |
| 10014234 | Semiconductor device comprising a die seal including long via lines | Dirk Breuer, Maik Liebau | 2018-07-03 |
| 9898572 | Metal line layout based on line shifting | Thomas Melde, Thomas Herrmann, Jens Hassmann, Moritz Andreas Meyer, Rakesh Kumar Kuncha | 2018-02-20 |
| 9524239 | Self service propagation of custom extension fields into web services | Georg Wilhelm, Daniel Niehoff, Uwe Schlarb, Rene Dehn, Daniel Figus +4 more | 2016-12-20 |
| 9450042 | Integrated circuits with metal-insulator-metal (MIM) capacitors and methods for fabricating same | — | 2016-09-20 |
| 9324631 | Semiconductor device including a stress buffer material formed above a low-k metallization system | Axel Walter | 2016-04-26 |
| 9244697 | Stable anchors in user interface to support life cycle extensions | Uwe Schlarb, Ioannis Grammatikakis, Gregor K. Frey, Markus Viol, Stefan Baeuerle +2 more | 2016-01-26 |
| 9136234 | Semiconductor device with improved metal pillar configuration | Marcel Wieland, Martin O'Toole | 2015-09-15 |
| 9054112 | Semiconductor device comprising a die seal having an integrated alignment mark | — | 2015-06-09 |
| 8924565 | Transport of customer flexibility changes in a multi-tenant environment | Stefan Baeuerle, Karsten Fanghaenel, Bernhard Thimmel, Uwe Schlarb, Olaf Meincke +2 more | 2014-12-30 |
| 8920027 | Assessing thermal mechanical characteristics of complex semiconductor devices by integrated heating systems | Michael Grillberger, Frank Kuechenmeister, Steffen Koch | 2014-12-30 |
| 8863005 | Propagating business object extension fields from source to target | Stefan Baeuerle, Karsten Fanghaenel, Daniel Figus, Uwe Schlarb, Bernhard Thimmel +2 more | 2014-10-14 |
| 8841140 | Technique for forming a passivation layer without a terminal metal | Tobias Letz, Joerg Hohage, Frank Kuechenmeister | 2014-09-23 |
| 8828888 | Protection of reactive metal surfaces of semiconductor devices during shipping by providing an additional protection layer | Joerg Hohage, Andreas Ott | 2014-09-09 |
| 8819075 | Facilitation of extension field usage based on reference field usage | Uwe Schlarb, Rene Dehn, Daniel Niehoff, Stefan Baeuerle, Bernhard Thimmel +2 more | 2014-08-26 |
| 8575029 | Technique for forming metal lines in a semiconductor by adapting the temperature dependence of the line resistance | Moritz Andreas Meyer, Eckhard Langer | 2013-11-05 |
| 8561446 | Method and device for fabricating bonding wires on the basis of microelectronic manufacturing techniques | Frank Kuechenmeister, Frank Seliger | 2013-10-22 |
| 8501545 | Reduction of mechanical stress in metal stacks of sophisticated semiconductor devices during die-substrate soldering by an enhanced cool down regime | Michael Grillberger, Rainer Giedigkeit | 2013-08-06 |
| 8489640 | Field extensibility using generic boxed components | Uwe Schlarb, Stefan Baeuerle, Bernhard Thimmel, Karsten Fanghänel, Johannes Haselberger +2 more | 2013-07-16 |
| 8482123 | Stress reduction in chip packaging by using a low-temperature chip-package connection regime | Michael Grillberger, Thomas Werner | 2013-07-09 |
| 8479578 | Assessing metal stack integrity in sophisticated semiconductor devices by mechanically stressing die contacts | Holm Geisler, Frank Kuechenmeister, Michael Grillberger | 2013-07-09 |