ML

Matthias Lehr

Globalfoundries: 22 patents #130 of 4,424Top 3%
AM AMD: 21 patents #507 of 9,279Top 6%
Infineon Technologies Ag: 11 patents #789 of 7,486Top 15%
SS Sap Se: 7 patents #439 of 6,322Top 7%
SA Sap Ag: 3 patents #810 of 3,812Top 25%
Merck: 3 patents #3,073 of 9,382Top 35%
UN Unknown: 1 patents #29,356 of 83,584Top 40%
VG Voith Patent Gmbh: 1 patents #277 of 717Top 40%
Overall (All Time): #30,927 of 4,157,543Top 1%
68
Patents All Time

Issued Patents All Time

Showing 51–68 of 68 patents

Patent #TitleCo-InventorsDate
7491638 Method of forming an insulating capping layer for a copper metallization layer Joerg Hohage, Volker Kahlert 2009-02-17
7476626 Etch stop layer for a metallization layer with enhanced etch selectivity and hermeticity Joerg Hohage, Volker Kahlert 2009-01-13
7416992 Method of patterning a low-k dielectric using a hard mask Peter Huebler, Christian Zistl 2008-08-26
7375032 Semiconductor substrate thinning method for manufacturing thinned die Frank Seliger, Marcel Wieland, Lothar Mergili, Frank Kuechenmeister 2008-05-20
7306976 Technique for enhancing thermal and mechanical characteristics of an underfill material of a substrate/die assembly Frank Feustel, Frank Kuechenmeister 2007-12-11
6803612 Integrated circuit having electrical connecting elements Jens Mockel, Dirk Tobben 2004-10-12
6737748 Stacked via with specially designed landing pad for integrated semiconductor structures Lothar Bauch, Thomas Zell, Albrecht Kieslich 2004-05-18
6716678 Method for producing an antifuse and antifuse for the selective electrical connection of adjacent conductive regions Uwe Schilling, Veronika Polei, Irene Sperl 2004-04-06
6635567 Method of producing alignment marks Eva Ebertseder, Torsten Werneke, Jochen Hanebeck, Jürgen Pahlitzsch 2003-10-21
6559547 Patterning of content areas in multilayer metalization configurations of semiconductor components Albrecht Kieslich, Peter Thieme, Lars Voland 2003-05-06
6559067 Method for patterning an organic antireflection layer Gregoire Grandremy 2003-05-06
6458631 Method for fabricating an integrated circuit, in particular an antifuse Axel Brintzinger, Ulrich Frey, Jürgen Lindolf, Dominique Savignac, Stefan Dankowski +2 more 2002-10-01
6455435 Method for fabricating a wiring plane on a semiconductor chip with an antifuse Wolfgang Leiberg 2002-09-24
6429503 Connection element in an integrated circuit having a layer structure disposed between two conductive structures Rene Tews, Jochen Müller, Jürgen Lindolf 2002-08-06
6387792 Method of fabricating a dielectric antifuse structure Rene Tews 2002-05-14
6337263 Method for improving the quality of metal conductor tracks on semiconductor structures 2002-01-08
6310217 Acylpyrroledicarboxylic acids and acylindoledicarboxylic acids and their derivatives as inhibitors of cytosolic phospholipase A2 2001-10-30
5260451 Substituted pyrrole compounds and use thereof in pharmaceutical compositions Gerd Dannhardt, Ludwig Steindl 1993-11-09