Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8698312 | Semiconductor device including a hybrid metallization layer stack for enhanced mechanical strength during and after packaging | James Werking, Frank Feustel, Peter Huebler | 2014-04-15 |
| 7737021 | Resist trim process to define small openings in dielectric layers | Srikanteswara Dakshina-Murthy, Paul R. Besser, Jonathan B. Smith, Eric M. Apelgren, Jeremy I. Martin +2 more | 2010-06-15 |
| 7416992 | Method of patterning a low-k dielectric using a hard mask | Matthias Lehr, Peter Huebler | 2008-08-26 |
| 7005380 | Simultaneous formation of device and backside contacts on wafers having a buried insulator layer | Massud Aminpur, Gert Burbach | 2006-02-28 |
| 6881665 | Depth of focus (DOF) for trench-first-via-last (TFVL) damascene processing with hard mask and low viscosity photoresist | Ting Tsui, Stephen Keetai Park | 2005-04-19 |
| 6806191 | Semiconductor device with a copper line having an increased resistance against electromigration and a method of forming the same | Jörg Hohage, Hartmut Rülke, Peter Hübler | 2004-10-19 |
| 6610594 | Locally increasing sidewall density by ion implantation | Eric M. Apelgren, Jeremy I. Martin, Paul R. Besser, Fred Cheung | 2003-08-26 |
| 6514844 | Sidewall treatment for low dielectric constant (low K) materials by ion implantation | Jeremy I. Martin, Eric M. Apelgren, Paul R. Besser, Srikantewara Dakshina-Murthy, Jonathan B. Smith +2 more | 2003-02-04 |
| 6500755 | Resist trim process to define small openings in dielectric layers | Srikanteswara Dakshina-Murthy, Paul R. Besser, Jonathan B. Smith, Eric M. Apelgren, Jeremy I. Martin +2 more | 2002-12-31 |
| 6406993 | Method of defining small openings in dielectric layers | Srikanteswara Dakshina-Murthy, Paul R. Besser, Jonathan B. Smith, Eric M. Apelgren, Jeremy I. Martin +2 more | 2002-06-18 |
| 6313538 | Semiconductor device with partial passivation layer | Paul R. Besser, Eric M. Apelgren, Nicholas J. Kepler, Srikanteswara Dakshina-Murthy | 2001-11-06 |
| 6268255 | Method of forming a semiconductor device with metal silicide regions | Paul R. Besser, Nicholas J. Kepler | 2001-07-31 |
| 6261963 | Reverse electroplating of barrier metal layer to improve electromigration performance in copper interconnect devices | Larry Zhao, Paul R. Besser, Eric M. Apelgren, Jonathan B. Smith | 2001-07-17 |