Issued Patents All Time
Showing 25 most recent of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7939400 | Systems and methods that selectively modify liner induced stress | Satyavolu S. Papa Rao, Haowen Bu, Robert J. Kraft | 2011-05-10 |
| 7682989 | Formation of a silicon oxide interface layer during silicon carbide etch stop deposition to promote better dielectric stack adhesion | Laura M. Matz, Thad E. Briggs, Robert J. Kraft | 2010-03-23 |
| 7678713 | Energy beam treatment to improve packaging reliability | Andrew John McKerrow, Satyavolu Srinivas Papa Rao, Robert J. Kraft | 2010-03-16 |
| 7442597 | Systems and methods that selectively modify liner induced stress | Satyavolu S. Papa Rao, Haowen Bu, Robert J. Kraft | 2008-10-28 |
| 7341941 | Methods to facilitate etch uniformity and selectivity | Jeannette Michelle Jacques, Robert J. Kraft, Ping Jiang | 2008-03-11 |
| 7342315 | Method to increase mechanical fracture robustness of porous low k dielectric materials | Andrew John McKerrow, Jeannette Michelle Jacques | 2008-03-11 |
| 7282436 | Plasma treatment for silicon-based dielectrics | Ping Jiang, Hyesook Hong, Robert J. Kraft | 2007-10-16 |
| 7268073 | Post-polish treatment for inhibiting copper corrosion | Deepak A. Ramappa, Mona Eissa, Christopher Lyle Borst | 2007-09-11 |
| 7087518 | Method of passivating and/or removing contaminants on a low-k dielectric/copper surface | David Gerald Farber, William W. Dostalik, Robert J. Kraft, Andrew John McKerrow, Kenneth Newton | 2006-08-08 |
| 6903000 | System for improving thermal stability of copper damascene structure | Jiong-Ping Lu, Qi-Zhong Hong, Tz-Cheng Chiu, Changming Jin, David Permana | 2005-06-07 |
| 6881665 | Depth of focus (DOF) for trench-first-via-last (TFVL) damascene processing with hard mask and low viscosity photoresist | Stephen Keetai Park, Christian Zistl | 2005-04-19 |
| 6806103 | Method for fabricating semiconductor devices that uses efficient plasmas | Andrew John McKerrow, Yuji Richard Kuan | 2004-10-19 |
| 6780756 | Etch back of interconnect dielectrics | David Gerald Farber, Robert J. Kraft, Craig Huffman | 2004-08-24 |
| 6607945 | Laser-assisted silicide fuse programming | — | 2003-08-19 |
| 6583070 | Semiconductor device having a low dielectric constant material | Ercan Adem | 2003-06-24 |
| 6498112 | Graded oxide caps on low dielectric constant (low K) chemical vapor deposition (CVD) films | Jeremy I. Martin | 2002-12-24 |
| 6489238 | Method to reduce photoresist contamination from silicon carbide films | — | 2002-12-03 |
| 6407558 | Method of determining the doping concentration across a surface of a semiconductor material | Sunil N. Shabde, Yowjuang W. Liu | 2002-06-18 |
| 6339958 | Adhesion strength testing using a depth-sensing indentation technique | Young-Chang Joo | 2002-01-22 |
| 6320403 | Method of determining the doping concentration and defect profile across a surface of a processed semiconductor material | Sunil N. Shabde, Yowjuang W. Liu | 2001-11-20 |
| 6309942 | STI punch-through defects and stress reduction by high temperature oxide reflow process | Robert H. Tu, Xiao-Yu Li, Sunil Mehta | 2001-10-30 |
| 6242790 | Using polysilicon fuse for IC programming | Reading Maley | 2001-06-05 |
| 6208030 | Semiconductor device having a low dielectric constant material | Ercan Adem | 2001-03-27 |
| 6208154 | Method of determining the doping concentration across a surface of a semiconductor material | Sunil N. Shabde, Yowjuang W. Liu | 2001-03-27 |
| 6177802 | System and method for detecting defects in an interlayer dielectric of a semiconductor device using the hall-effect | Sunil N. Shabde, Yowjuang W. Liu | 2001-01-23 |