Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7268073 | Post-polish treatment for inhibiting copper corrosion | Deepak A. Ramappa, Mona Eissa, Ting Tsui | 2007-09-11 |
| 6776688 | Real-time polishing pad stiffness-control using magnetically controllable fluid | Andrew Tae Kim, Matthew Losey | 2004-08-17 |
| 6693357 | Methods and semiconductor devices with wiring layer fill structures to improve planarization uniformity | Alwin Tsao, Bobby David Strong, Noel Russell | 2004-02-17 |