| 12512322 |
Small grain size polysilicon engineering for threshold voltage mismatch improvement |
Bhaskar Srinivasan, Pushpa Mahalingam, Mahalingam Nandakumar, Corinne Ann Gagnet, Christopher Scott Whitesell |
2025-12-30 |
|
| 11972942 |
Gate oxide fabrication and system |
Corinne Ann Gagnet, Christopher Scott Whitesell, Pushpa Mahalingam |
2024-04-30 |
$47,205,000 |
| 11616011 |
IC having trench-based metal-insulator-metal capacitor |
Umamaheswari Aghoram, Pushpa Mahalingam, Erich Wesley Kinder, Bhaskar Srinivasan, Brian E. Goodlin |
2023-03-28 |
$31,423,000 |
| 11508721 |
Integrated fluxgate device |
Mark R. Kimmich, Sudtida Lavangkul, Sopa Chevacharoenkul, Mark L. Jenson |
2022-11-22 |
$32,493,000 |
| 11075157 |
IC having trench-based metal-insulator-metal capacitor |
Umamaheswari Aghoram, Pushpa Mahalingam, Erich Wesley Kinder, Bhaskar Srinivasan, Brian E. Goodlin |
2021-07-27 |
$44,725,000 |
| 10978448 |
Integrated fluxgate device |
Mark R. Kimmich, Sudtida Lavangkul, Sopa Chevacharoenkul, Mark L. Jenson |
2021-04-13 |
$33,270,000 |
| 10718826 |
High performance fluxgate device |
Dok Won Lee |
2020-07-21 |
$37,976,000 |
| 10266950 |
Process for NiFe fluxgate device |
Yousong Zhang, Mark L. Jenson |
2019-04-23 |
$35,726,000 |
| 10199573 |
Magnetic core |
Dok Won Lee, Byron Jon Roderick Shulver, Yousong Zhang |
2019-02-05 |
$20,780,000 |
| 10017851 |
Magnetic field annealing for integrated fluxgate sensors |
Dok Won Lee, Neal Murphy |
2018-07-10 |
$36,647,000 |
| 10005662 |
Selective patterning of titanium encapsulation layers |
Lee Alan Stringer, Byron J.R. Shulver, Sopa Chevacharoenkul, Mark R. Kimmich, Sudtida Lavangkul +1 more |
2018-06-26 |
$22,591,000 |
| 9840781 |
Process for NiFe fluxgate device |
Yousong Zhang, Mark L. Jenson |
2017-12-12 |
$24,947,000 |
| 9771261 |
Selective patterning of an integrated fluxgate device |
Lee Alan Stringer, Byron J.R. Shulver, Sopa Chevacharoenkul, Mark R. Kimmich, Sudtida Lavangkul +1 more |
2017-09-26 |
$23,482,000 |
| 8288283 |
Aluminum enhanced palladium CMP process |
Brian Zinn |
2012-10-16 |
$6,135,000 |
| 7833895 |
TSVS having chemically exposed TSV tips for integrated circuit devices |
Thomas D. Bonifield, Brian E. Goodlin |
2010-11-16 |
$12,504,000 |
| 7354853 |
Selective dry etching of tantalum and tantalum nitride |
Troy A. Yocum |
2008-04-08 |
$14,387,000 |
| 7268073 |
Post-polish treatment for inhibiting copper corrosion |
Deepak A. Ramappa, Christopher Lyle Borst, Ting Tsui |
2007-09-11 |
$11,319,000 |
| 7232768 |
Hydrogen plasma photoresist strip and polymeric residue cleanup process for low dielectric constant materials |
Patricia B. Smith |
2007-06-19 |
$17,017,000 |
| 7179751 |
Hydrogen plasma photoresist strip and polymeric residue cleanup process for low dielectric constant materials |
Patricia B. Smith |
2007-02-20 |
$14,955,000 |
| 7153782 |
Effective solution and process to wet-etch metal-alloy films in semiconductor processing |
— |
2006-12-26 |
$9,254,000 |
| 6997192 |
Control of dissolved gas levels in deionized water |
Nilesh Doke, Jeffrey Hanson |
2006-02-14 |
$19,296,000 |
| 6967173 |
Hydrogen plasma photoresist strip and polymeric residue cleanup processs for low dielectric constant materials |
Patricia B. Smith |
2005-11-22 |
$14,237,000 |
| 6939795 |
Selective dry etching of tantalum and tantalum nitride |
Troy A. Yocum |
2005-09-06 |
$15,447,000 |
| 6806193 |
CMP in-situ conditioning with pad and retaining ring clean |
Vincent C. Korthuis, Yaojian Leng, Syed Hamid |
2004-10-19 |
$15,318,000 |
| 6723658 |
Gate structure and method |
Antonio Rotondaro |
2004-04-20 |
$14,356,000 |