Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7727885 | Reduction of punch-thru defects in damascene processing | Phillip D. Matz, Sopa Chevacharoenkul, Ching-Te Lin, Basab Chatterjee, Anand J. Reddy +1 more | 2010-06-01 |
| 7087518 | Method of passivating and/or removing contaminants on a low-k dielectric/copper surface | David Gerald Farber, William W. Dostalik, Robert J. Kraft, Andrew John McKerrow, Ting Tsui | 2006-08-08 |
| 6872665 | Process flow for dual damescene interconnect structures | Francis G. Celii, Guoqiang Xing, Andrew John McKerrow, Andrew Ralston, Zhicheng Tang +2 more | 2005-03-29 |
| 6861348 | Pre-pattern surface modification of low-k dielectrics | Brian K. Kirkpatrick, Michael Morrison, Andrew John McKerrow, Dirk N. Anderson | 2005-03-01 |
| 6797633 | In-situ plasma ash/treatment after via etch of low-k films for poison-free dual damascene trench patterning | Ping Jiang, Robert J. Kraft, Daty M. Rogers | 2004-09-28 |
| 6774031 | Method of forming dual-damascene structure | Abbas Ali | 2004-08-10 |
| 6723636 | Methods for forming multiple damascene layers | Noel Russell, Changming Jin | 2004-04-20 |
| 6720247 | Pre-pattern surface modification for low-k dielectrics using A H2 plasma | Brian K. Kirkpatrick, Michael Morrison, Andrew John McKerrow, Dirk N. Anderson | 2004-04-13 |
| 6455411 | Defect and etch rate control in trench etch for dual damascene patterning of low-k dielectrics | Ping Jiang, Francis G. Celii, Hiromi Sakima | 2002-09-24 |