| 12261236 |
Conductive member and manufacturing method therefor, and photovoltaic module and manufacturing method therefor |
Shifeng Deng, Jingbing Dong, Hui Chen, Tao Xu |
2025-03-25 |
|
| 11094838 |
Texturization method of silicon wafers, product obtained therefrom and preparation method of solar cells |
Shuai Zou, Xiaoya Ye, Fang Cao, Xusheng Wang |
2021-08-17 |
|
| D920897 |
Photovoltaic cell panel |
Jie Xu, Zhengyue Xia, Xinchun Yan, Minjie Zhu, Gang Lu |
2021-06-01 |
|
| D902844 |
Solar cell panel |
Jie Xu, Zhengyue Xia, Xinchun Yan, Minjie Zhu, Gang Lu |
2020-11-24 |
|
| D902845 |
Solar cell panel |
Zhengyue Xia, Jie Xu, Xinchun Yan, Minjie Zhu |
2020-11-24 |
|
| D894115 |
Solar panel |
Zhengyue Xia, Jie Xu, Xinchun Yan, Minjie Zhu |
2020-08-25 |
|
| 10411145 |
Method for producing a textured structure of a crystalline silicon solar cell |
Shuai Zou, Xusheng Wang |
2019-09-10 |
|
| 9966484 |
Process for preparing passivated emitter rear contact (PERC) solar cells |
Shuai Zou, Weixu Long, Xusheng Wang |
2018-05-08 |
|
| 7361599 |
Integrated circuit and method |
Theodore S. Moise, Mark Visokay, Justin Gaynor, Stephen Roy Gilbert, Francis G. Celii +2 more |
2008-04-22 |
$7,957,000 |
| 7214609 |
Methods for forming single damascene via or trench cavities and for forming dual damascene via cavities |
Ping Jiang, Rob Kraft, Karen Kirmse, Eden Zielinski |
2007-05-08 |
$21,644,000 |
| 7129162 |
Dual cap layer in damascene interconnection processes |
Hyesook Hong, Ping Jiang |
2006-10-31 |
$10,177,000 |
| 6958294 |
Method for photoresist strip, sidewall polymer removal and passivation for aluminum metallization |
Patricia B. Smith, David B. Aldrich |
2005-10-25 |
$14,208,000 |
| 6902939 |
Integrated circuit and method |
Theodore S. Moise, Mark Visokay, Justin Gaynor, Stephen Roy Gilbert, Francis G. Celii +2 more |
2005-06-07 |
$25,702,000 |
| 6872665 |
Process flow for dual damescene interconnect structures |
Francis G. Celii, Andrew John McKerrow, Andrew Ralston, Zhicheng Tang, Kenneth Newton +2 more |
2005-03-29 |
$17,205,000 |
| 6806101 |
Ferroelectric capacitor plasma charging monitor |
Shawming Ma, Stephen Roy Gilbert |
2004-10-19 |
|
| 6692976 |
Post-etch cleaning treatment |
Laura Wills Mirkarimi, Stephen Roy Gilbert, Scott R. Summerfelt, Tomoyuki Sakoda, Ted S. Moise |
2004-02-17 |
|
| 6635498 |
Method of patterning a FeRAM capacitor with a sidewall during bottom electrode etch |
Scott R. Summerfelt, Luigi Colombo, Sanjeev Aggarwal, Theodore S. Moise |
2003-10-21 |
|
| 6620560 |
Plasma treatment of low-k dielectric films to improve patterning |
Ping Jiang, Andrew John McKerrow, Robert J. Kraft, Hyesook Hong |
2003-09-16 |
$22,828,000 |
| 6605536 |
Treatment of low-k dielectric films to enable patterning of deep submicron features |
Mona Eissa, Kenneth D. Brennan, Hyesook Hong |
2003-08-12 |
$40,591,000 |
| 6599829 |
Method for photoresist strip, sidewall polymer removal and passivation for aluminum metallization |
Patricia B. Smith, David B. Aldrich |
2003-07-29 |
$48,919,000 |
| 6576922 |
Ferroelectric capacitor plasma charging monitor |
Shawming Ma, Stephen Roy Gilbert |
2003-06-10 |
|
| 6573167 |
Using a carbon film as an etch hardmask for hard-to-etch materials |
Wei-Yung Hsu, Changming Jin |
2003-06-03 |
$32,855,000 |
| 6555431 |
Method for forming integrated circuit capacitor and memory |
Scott R. Summerfelt, Rajesh Khamankar |
2003-04-29 |
$22,974,000 |
| 6548343 |
Method of fabricating a ferroelectric memory cell |
Scott R. Summerfelt, Theodore S. Moise, Luigi Colombo, Tomoyuki Sakoda, Stephen Roy Gilbert +5 more |
2003-04-15 |
$9,164,000 |
| 6534809 |
Hardmask designs for dry etching FeRAM capacitor stacks |
Theodore S. Moise, Stephen Roy Gilbert, Scott R. Summerfelt, Luigi Colombo |
2003-03-18 |
$11,393,000 |