Issued Patents All Time
Showing 26–36 of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6492222 | Method of dry etching PZT capacitor stack to form high-density ferroelectric memory devices | — | 2002-12-10 |
| 6485988 | Hydrogen-free contact etch for ferroelectric capacitor formation | Shawming Ma, Rahim Kavari, Scott R. Summerfelt, Tomoyuki Sakoda | 2002-11-26 |
| 6444542 | Integrated circuit and method | Theodore S. Moise, Mark Visokay, Justin Gaynor, Stephen Roy Gilbert, Francis G. Celii +2 more | 2002-09-03 |
| 6424040 | Integration of fluorinated dielectrics in multi-level metallizations | Somnath Nag, Changming Jin, Wei-Yung Hsu | 2002-07-23 |
| 6410426 | Damascene cap layer process for integrated circuit interconnects | Ping Jiang | 2002-06-25 |
| 6211035 | Integrated circuit and method | Theodore S. Moise, Mark Visokay, Justin Gaynor, Stephen Roy Gilbert, Francis G. Celii +2 more | 2001-04-03 |
| 6194313 | Method for reducing recess for the formation of local interconnect and or plug trench fill for etchback process | Abha Singh, Girish Dixit, Wei-Yung Hsu | 2001-02-27 |
| 6171970 | Method for forming high-density integrated circuit capacitors | Abbas Ali, Theodore S. Moise | 2001-01-09 |
| 6153490 | Method for forming integrated circuit capacitor and memory | Scott R. Summerfelt, Rajesh Khamankar | 2000-11-28 |
| 6090697 | Etchstop for integrated circuits | Glenn A. Cerny, Mark Visokay | 2000-07-18 |
| 5880026 | Method for air gap formation by plasma treatment of aluminum interconnects | Kenneth D. Brennan | 1999-03-09 |