Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7569464 | Method for manufacturing a semiconductor device having improved across chip implant uniformity | Yuanning Chen, Jarvis Benjamin Jacobs, Deborah J. Riley | 2009-08-04 |
| 7214609 | Methods for forming single damascene via or trench cavities and for forming dual damascene via cavities | Ping Jiang, Rob Kraft, Guoqiang Xing, Eden Zielinski | 2007-05-08 |
| 7033897 | Encapsulated spacer with low dielectric constant material to reduce the parasitic capacitance between gate and drain in CMOS technology | Yuanning Chen, Antonio Luis Pacheco Rotondaro | 2006-04-25 |
| 6998221 | Method for forming a via in a substrate | — | 2006-02-14 |