YC

Yuanning Chen

TI Texas Instruments: 8 patents #1,843 of 12,488Top 15%
AS Agere Systems: 5 patents #269 of 1,849Top 15%
AG Agere Systems Guardian: 3 patents #85 of 810Top 15%
Overall (All Time): #272,718 of 4,157,543Top 7%
17
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
11004612 Low temperature sub-nanometer periodic stack dielectrics Jesus Israel Mejia Silva, Chunya Wu, Deborah J. Riley, Yun Ju Lee 2021-05-11
9048151 Self-powered integrated circuit with photovoltaic cell Nagarajan Sridhar 2015-06-02
8883541 Self-powered integrated circuit with multi-junction photovoltaic cell Thomas Patrick Conroy, Jeffrey R. Debord, Nagarajan Sridhar 2014-11-11
8552470 Self-powered integrated circuit with multi-junction photovoltaic cell Thomas Patrick Conroy, Jeffrey R. Debord, Nagarajan Sridhar 2013-10-08
7800226 Integrated circuit with metal silicide regions Maxwell Lippitt, William M. Moller 2010-09-21
7704883 Annealing to improve edge roughness in semiconductor technology Stephanie W. Butler 2010-04-27
7667275 Using oxynitride spacer to reduce parasitic capacitance in CMOS devices Haowen Bu, Kaiping Liu 2010-02-23
7569464 Method for manufacturing a semiconductor device having improved across chip implant uniformity Karen Kirmse, Jarvis Benjamin Jacobs, Deborah J. Riley 2009-08-04
7276408 Reduction of dopant loss in a gate structure Mark Visokay 2007-10-02
7250356 Method for forming metal silicide regions in an integrated circuit Maxwell Lippitt, William M. Moller 2007-07-31
7148153 Process for oxide fabrication using oxidation steps below and above a threshold temperature Sundar Srinivasan Chetlur, Pradip K. Roy 2006-12-12
7033897 Encapsulated spacer with low dielectric constant material to reduce the parasitic capacitance between gate and drain in CMOS technology Antonio Luis Pacheco Rotondaro, Karen Kirmse 2006-04-25
6930006 Electronic circuit structure with improved dielectric properties Konstantin Bourdelle 2005-08-16
6551946 TWO-STEP OXIDATION PROCESS FOR OXIDIZING A SILICON SUBSTRATE WHEREIN THE FIRST STEP IS CARRIED OUT AT A TEMPERATURE BELOW THE VISCOELASTIC TEMPERATURE OF SILICON DIOXIDE AND THE SECOND STEP IS CARRIED OUT AT A TEMPERATURE ABOVE THE VISCOELASTIC TEMPERATURE Sundar Srinivasan Chetlur, Pradip K. Roy 2003-04-22
6541394 Method of making a graded grown, high quality oxide layer for a semiconductor device Sailesh Mansinh Merchant, Pradip K. Roy 2003-04-01
6492712 High quality oxide for use in integrated circuits Sundar Srinivasan Chetlur, Sailesh Mansinh Merchant, Pradip K. Roy 2002-12-10
6303397 Method for benchmarking thin film measurement tools Linette Lozada, Yi Ma, Roger M. Young 2001-10-16