Issued Patents All Time
Showing 25 most recent of 135 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9613847 | Integration of shallow trench isolation and through-substrate vias into integrated circuit designs | Mark A. Bachman, John W. Osenbach | 2017-04-04 |
| 9054064 | Stacked interconnect heat sink | Mark A. Bachman, John W. Osenbach | 2015-06-09 |
| 8987137 | Method of fabrication of through-substrate vias | Mark A. Bachman, John W. Osenbach | 2015-03-24 |
| 8854115 | Preventing electronic device counterfeits | Kouros Azimi | 2014-10-07 |
| 8742535 | Integration of shallow trench isolation and through-substrate vias into integrated circuit designs | Mark A. Bachman, John W. Osenbach | 2014-06-03 |
| 8507317 | Solder bump structure for flip chip semiconductor devices and method of manufacturing therefore | Mark A. Bachman, Donald S. Bitting, Sailesh Chittipeddi, Seung H. Kang | 2013-08-13 |
| 8492911 | Stacked interconnect heat sink | Mark A. Bachman, John W. Osenbach | 2013-07-23 |
| 8319343 | Routing under bond pad for the replacement of an interconnect layer | Vance D. Archer, III, Michael AYUKAWA, Mark A. Bachman, Daniel Chesire, Seung H. Kang +2 more | 2012-11-27 |
| 7973544 | Thermal monitoring and management of integrated circuits | Vance D. Archer, III, Daniel Chesire, Warren K. Gladden, Seung H. Kang, Taeho Kook +1 more | 2011-07-05 |
| 7952206 | Solder bump structure for flip chip semiconductor devices and method of manufacture therefore | Mark A. Bachman, Donald S. Bitting, Sailesh Chittipeddi, Seung H. Kang | 2011-05-31 |
| 7948914 | Power learning security in wireless routers | Kouros Azimi, Mohammad S. Mobin, Roger A. Fratti, Kenneth W. Paist | 2011-05-24 |
| 7804291 | Semiconductor test device with heating circuit | Seung H. Kang, Lisa Mullin, Subramanian Karthikeyan | 2010-09-28 |
| 7777333 | Structure and method for fabricating flip chip devices | Mark A. Bachman, Donald S. Bitting, Daniel Chesire, Taeho Kook | 2010-08-17 |
| 7727894 | Formation of an integrated circuit structure with reduced dishing in metallization levels | Sailesh Chittipeddi | 2010-06-01 |
| 7678639 | Inductor formed in an integrated circuit | Edward B. Harris, Kurt G. Steiner, Susan Clay Vitkavage | 2010-03-16 |
| 7566964 | Aluminum pad power bus and signal routing for integrated circuit devices utilizing copper technology interconnect structures | Seung H. Kang, Roland Krebs, Kurt G. Steiner, Michael AYUKAWA | 2009-07-28 |
| 7541238 | Inductor formed in an integrated circuit | Edward B. Harris, Kurt G. Steiner, Susan Clay Vitkavage | 2009-06-02 |
| 7429502 | Integrated circuit device incorporating metallurgical bond to enhance thermal conduction to a heat sink | Vance D. Archer, III, Kouros Azimi, Daniel Chesire, Warren K. Gladden, Seung H. Kang +2 more | 2008-09-30 |
| 7397103 | Semiconductor with damage detection circuitry | Vance D. Archer, III, Daniel Chesire, Seung H. Kang, Taeho Kook | 2008-07-08 |
| 7388395 | Test semiconductor device and method for determining Joule heating effects in such a device | Seung H. Kang, Subramanian Karthikeyan | 2008-06-17 |
| 7328830 | Structure and method for bonding to copper interconnect structures | Mark A. Bachman, Daniel Chesire | 2008-02-12 |
| 7327029 | Integrated circuit device incorporating metallurigical bond to enhance thermal conduction to a heat sink | Vance D. Archer, III, Kouros Azimi, Daniel Chesire, Warren K. Gladden, Seung H. Kang +2 more | 2008-02-05 |
| 7301231 | Reinforced bond pad for a semiconductor device | Joze E. Antol, Philip William Seitzer, Daniel Chesire, Rafe Carl Mengel, Vance D. Archer, III +2 more | 2007-11-27 |
| 7301107 | Semiconductor device having reduced intra-level and inter-level capacitance | Subramanian Karthikeyan | 2007-11-27 |
| 7221173 | Method and structures for testing a semiconductor wafer prior to performing a flip chip bumping process | Mark A. Bachman, Daniel Chesire, Taeho Kook | 2007-05-22 |