Issued Patents All Time
Showing 25 most recent of 84 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12300621 | Hybrid integrated circuit package | Jiaming Zhang | 2025-05-13 |
| 12218031 | Thermal interface material containment | Gannon Reichert, Vinh T. Nguyen | 2025-02-04 |
| 11803021 | Opto-electronic package and a method for making an opto-electronic package | Franklin J. Wall, Jr., Jiaming Zhang | 2023-10-31 |
| 10962296 | Low-cost nano-heat pipe | Jie Tang, S. Eugene Messenger, John Coronati | 2021-03-30 |
| 10741999 | Tunable waveguide devices | Peter W. Evans, Mingzhi Lu, Fred A. Kish, Jr., Vikrant Lal, Scott Corzine +1 more | 2020-08-11 |
| 10290619 | Photonic integrated circuit package | Peter W. Evans, Fred A. Kish, Jr., Jiaming Zhang, Miguel Iglesias Olmedo, Maria Anagnosti | 2019-05-14 |
| 10205301 | Tunable waveguide devices | Peter W. Evans, Mingzhi Lu, Fred A. Kish, Jr., Vikrant Lal, Scott Corzine +1 more | 2019-02-12 |
| 10181697 | Tunable waveguide devices | Peter W. Evans, Mingzhi Lu, Fred A. Kish, Jr., Vikrant Lal, Scott Corzine +1 more | 2019-01-15 |
| 10181698 | Tunable waveguide devices | Peter W. Evans, Mingzhi Lu, Fred A. Kish, Jr., Vikrant Lal, Scott Corzine +1 more | 2019-01-15 |
| 10177531 | Tunable waveguide devices | Peter W. Evans, Mingzhi Lu, Fred A. Kish, Jr., Vikrant Lal, Scott Corzine +1 more | 2019-01-08 |
| 10175005 | Low-cost nano-heat pipe | Jie Tang, S. Eugene Messenger, John Coronati | 2019-01-08 |
| 10122149 | Tunable waveguide devices | Peter W. Evans, Mingzhi Lu, Fred A. Kish, Jr., Vikrant Lal, Scott Corzine +1 more | 2018-11-06 |
| 10037982 | Photonic integrated circuit package | Peter W. Evans, Fred A. Kish, Jr., Jiaming Zhang, Miguel Iglesias Olmedo, Maria Anagnosti | 2018-07-31 |
| 10026723 | Photonic integrated circuit package | Peter W. Evans, Fred A. Kish, Jr., Jiaming Zhang, Miguel Iglesias Olmedo, Maria Anagnosti | 2018-07-17 |
| 9784933 | Photonic integrated circuit (PIC) and silicon photonics (SIP) circuitry device | Timothy Butrie, Fred A. Kish, Jr., Michael Reffle | 2017-10-10 |
| 9613847 | Integration of shallow trench isolation and through-substrate vias into integrated circuit designs | Mark A. Bachman, Sailesh Mansinh Merchant | 2017-04-04 |
| 9443821 | Pb-free solder bumps with improved mechanical properties | Mark A. Bachman | 2016-09-13 |
| 9324557 | Method for fabricating equal height metal pillars of different diameters | Steven D. Cate | 2016-04-26 |
| 9136245 | Moisture barrier for a wire bond | John M. DeLucca, Ronald J. Weachock, Barry J. Dutt, Frank Baiocchi | 2015-09-15 |
| 9054064 | Stacked interconnect heat sink | Mark A. Bachman, Sailesh Mansinh Merchant | 2015-06-09 |
| 8987137 | Method of fabrication of through-substrate vias | Mark A. Bachman, Sailesh Mansinh Merchant | 2015-03-24 |
| 8869389 | Method of manufacturing an electronic device package | Larry Golick, Qwai H. Low, Matthew E. Stahley | 2014-10-28 |
| 8779587 | PB-free solder bumps with improved mechanical properties | Mark A. Bachman | 2014-07-15 |
| 8766436 | Moisture barrier for a wire bond | John M. DeLucca, Frank Baiocchi, Ronald J. Weachock, Barry J. Dutt | 2014-07-01 |
| 8742535 | Integration of shallow trench isolation and through-substrate vias into integrated circuit designs | Mark A. Bachman, Sailesh Mansinh Merchant | 2014-06-03 |