| 11195915 |
Semiconductor devices with a sloped surface |
Haian Lin, Seetharaman Sridhar |
2021-12-07 |
| 10826487 |
Power unit with an integrated pull-down transistor |
Haian Lin, Scott E. Ragona, Jonathan Almeria Noquil |
2020-11-03 |
| 10812064 |
Source down power FET with integrated temperature sensor |
Haian Lin, Masahiko Higashi, Namiko Hagane |
2020-10-20 |
| 10804263 |
Switching field plate power MOSFET |
Haian Lin |
2020-10-13 |
| 10746890 |
Power MOSFET with a deep source contact |
Furen Lin, Haian Lin, Yunlong Liu, Lark Liu, Wei Song +1 more |
2020-08-18 |
| 10707344 |
Power MOSFET with metal filled deep source contact |
Furen Lin, Yunlong Liu, Lark Liu, Tianping Lv, Peter Lin +1 more |
2020-07-07 |
| 10581426 |
Source down power FET with integrated temperature sensor |
Haian Lin, Masahiko Higashi, Namiko Hagane |
2020-03-03 |
| 10529706 |
Integrated transistor and protection diode and fabrication method |
Haian Lin |
2020-01-07 |
| 10529705 |
Integrated transistor and protection diode and fabrication method |
Haian Lin |
2020-01-07 |
| 10319712 |
Integrated transistor and protection diode and fabrication method |
Haian Lin |
2019-06-11 |
| 10068977 |
Power MOSFET with a deep source contact |
Furen Lin, Haian Lin, Yunlong Liu, Lark Liu, Wei Song +1 more |
2018-09-04 |
| 9853144 |
Power MOSFET with metal filled deep source contact |
Furen Lin, Yunlong Liu, Lark Liu, Tianping Lv, Peter Lin +1 more |
2017-12-26 |
| 9646965 |
Monolithically integrated transistors for a buck converter using source down MOSFET |
Jun Wang, Haian Lin |
2017-05-09 |
| 9136245 |
Moisture barrier for a wire bond |
John M. DeLucca, Ronald J. Weachock, Barry J. Dutt, John W. Osenbach |
2015-09-15 |
| 8766436 |
Moisture barrier for a wire bond |
John M. DeLucca, Ronald J. Weachock, John W. Osenbach, Barry J. Dutt |
2014-07-01 |
| 8610215 |
Allotropic or morphologic change in silicon induced by electromagnetic radiation for resistance turning of integrated circuits |
James T. Cargo, John M. DeLucca, Barry J. Dutt, Charles Martin |
2013-12-17 |
| 8318606 |
Dielectric etching |
David A. Kern, John M. DeLucca |
2012-11-27 |
| 8242378 |
Soldering method and related device for improved resistance to brittle fracture with an intermetallic compound region coupling a solder mass to an Ni layer which has a low concentration of P, wherein the amount of P in the underlying Ni layer is controlled as a function of the expected volume of the solder mass |
Ahmed Amin, John M. DeLucca, John W. Osenbach, Brian T. Vaccaro |
2012-08-14 |
| 8101871 |
Aluminum bond pads with enhanced wire bond stability |
John M. DeLucca, John W. Osenbach |
2012-01-24 |
| 7972873 |
Material removing processes in device formation and the devices formed thereby |
James T. Cargo, John M. DeLucca |
2011-07-05 |
| 7724359 |
Method of making electronic entities |
Ahmed Amin, Mark A. Bachman, John M. DeLucca, John W. Osenbach |
2010-05-25 |
| 7291849 |
Calibration standard for transmission electron microscopy |
John M. DeLucca, James T. Cargo |
2007-11-06 |
| 7126193 |
Metal-oxide-semiconductor device with enhanced source electrode |
Bailey Jones, Muhammed Ayman Shibib, Shuming Xu |
2006-10-24 |
| 7041561 |
Enhanced substrate contact for a semiconductor device |
Bailey Jones, Muhammed Ayman Shibib, Shuming Xu |
2006-05-09 |
| 6987052 |
Method for making enhanced substrate contact for a semiconductor device |
John Desko, Bailey Jones, Sean Lian |
2006-01-17 |