Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9613847 | Integration of shallow trench isolation and through-substrate vias into integrated circuit designs | Sailesh Mansinh Merchant, John W. Osenbach | 2017-04-04 |
| 9443821 | Pb-free solder bumps with improved mechanical properties | John W. Osenbach | 2016-09-13 |
| 9054064 | Stacked interconnect heat sink | John W. Osenbach, Sailesh Mansinh Merchant | 2015-06-09 |
| 8987137 | Method of fabrication of through-substrate vias | Sailesh Mansinh Merchant, John W. Osenbach | 2015-03-24 |
| 8779587 | PB-free solder bumps with improved mechanical properties | John W. Osenbach | 2014-07-15 |
| 8742535 | Integration of shallow trench isolation and through-substrate vias into integrated circuit designs | Sailesh Mansinh Merchant, John W. Osenbach | 2014-06-03 |
| 8580621 | Solder interconnect by addition of copper | John W. Osenbach, Kishor Desai | 2013-11-12 |
| 8507317 | Solder bump structure for flip chip semiconductor devices and method of manufacturing therefore | Donald S. Bitting, Sailesh Chittipeddi, Seung H. Kang, Sailesh Mansinh Merchant | 2013-08-13 |
| 8492911 | Stacked interconnect heat sink | John W. Osenbach, Sailesh Mansinh Merchant | 2013-07-23 |
| 8378485 | Solder interconnect by addition of copper | John W. Osenbach, Kishor Desai | 2013-02-19 |
| 8319343 | Routing under bond pad for the replacement of an interconnect layer | Vance D. Archer, III, Michael AYUKAWA, Daniel Chesire, Seung H. Kang, Taeho Kook +2 more | 2012-11-27 |
| 7952206 | Solder bump structure for flip chip semiconductor devices and method of manufacture therefore | Donald S. Bitting, Sailesh Chittipeddi, Seung H. Kang, Sailesh Mansinh Merchant | 2011-05-31 |
| 7777333 | Structure and method for fabricating flip chip devices | Donald S. Bitting, Daniel Chesire, Taeho Kook, Sailesh Mansinh Merchant | 2010-08-17 |
| 7724359 | Method of making electronic entities | Ahmed Amin, Frank Baiocchi, John M. DeLucca, John W. Osenbach | 2010-05-25 |
| 7671436 | Electronic packages | Ahmed Amin, David Crouthamel, John W. Osenbach, Brian T. Vaccaro | 2010-03-02 |
| 7479695 | Low thermal resistance assembly for flip chip applications | David Crouthamel | 2009-01-20 |
| 7328830 | Structure and method for bonding to copper interconnect structures | Daniel Chesire, Sailesh Mansinh Merchant | 2008-02-12 |
| 7221173 | Method and structures for testing a semiconductor wafer prior to performing a flip chip bumping process | Daniel Chesire, Taeho Kook, Sailesh Mansinh Merchant | 2007-05-22 |
| 6960836 | Reinforced bond pad | Daniel Chesire, Sailesh Mansinh Merchant, John W. Osenbach, Kurt G. Steiner | 2005-11-01 |