Mark A. Bachman — 19 Patents at Agere Systems

Mark A. Bachman has been granted 19 US patents while listed as an inventor at Agere Systems. The first was granted in 2005 and the most recent in April 2017. Mark A. Bachman ranks #229,345 of 4,157,543 US inventors in our database (top 5.5%). Patent records list Mark A. Bachman in Wilmington, DE, US.

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Showing 1–19 of 19 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
9613847	Integration of shallow trench isolation and through-substrate vias into integrated circuit designs	Sailesh Mansinh Merchant, John W. Osenbach	2017-04-04	$50,315,000
9443821	Pb-free solder bumps with improved mechanical properties	John W. Osenbach	2016-09-13	$99,841,000
9054064	Stacked interconnect heat sink	John W. Osenbach, Sailesh Mansinh Merchant	2015-06-09	$31,185,000
8987137	Method of fabrication of through-substrate vias	Sailesh Mansinh Merchant, John W. Osenbach	2015-03-24
8779587	PB-free solder bumps with improved mechanical properties	John W. Osenbach	2014-07-15
8742535	Integration of shallow trench isolation and through-substrate vias into integrated circuit designs	Sailesh Mansinh Merchant, John W. Osenbach	2014-06-03
8580621	Solder interconnect by addition of copper	John W. Osenbach, Kishor Desai	2013-11-12
8507317	Solder bump structure for flip chip semiconductor devices and method of manufacturing therefore	Donald S. Bitting, Sailesh Chittipeddi, Seung H. Kang, Sailesh Mansinh Merchant	2013-08-13
8492911	Stacked interconnect heat sink	John W. Osenbach, Sailesh Mansinh Merchant	2013-07-23
8378485	Solder interconnect by addition of copper	John W. Osenbach, Kishor Desai	2013-02-19
8319343	Routing under bond pad for the replacement of an interconnect layer	Vance D. Archer, III, Michael AYUKAWA, Daniel Chesire, Seung H. Kang, Taeho Kook +2 more	2012-11-27
7952206	Solder bump structure for flip chip semiconductor devices and method of manufacture therefore	Donald S. Bitting, Sailesh Chittipeddi, Seung H. Kang, Sailesh Mansinh Merchant	2011-05-31
7777333	Structure and method for fabricating flip chip devices	Donald S. Bitting, Daniel Chesire, Taeho Kook, Sailesh Mansinh Merchant	2010-08-17
7724359	Method of making electronic entities	Ahmed Amin, Frank Baiocchi, John M. DeLucca, John W. Osenbach	2010-05-25
7671436	Electronic packages	Ahmed Amin, David Crouthamel, John W. Osenbach, Brian T. Vaccaro	2010-03-02
7479695	Low thermal resistance assembly for flip chip applications	David Crouthamel	2009-01-20
7328830	Structure and method for bonding to copper interconnect structures	Daniel Chesire, Sailesh Mansinh Merchant	2008-02-12
7221173	Method and structures for testing a semiconductor wafer prior to performing a flip chip bumping process	Daniel Chesire, Taeho Kook, Sailesh Mansinh Merchant	2007-05-22
6960836	Reinforced bond pad	Daniel Chesire, Sailesh Mansinh Merchant, John W. Osenbach, Kurt G. Steiner	2005-11-01	$11,315,000

Mark A. Bachman — 19 Patents

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