MB

Mark A. Bachman

AS Agere Systems: 11 patents #86 of 1,849Top 5%
LS Lsi: 5 patents #274 of 1,740Top 20%
AP Avago Technologies General Ip (Singapore) Pte.: 3 patents #357 of 2,004Top 20%
Overall (All Time): #238,943 of 4,157,543Top 6%
19
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
9613847 Integration of shallow trench isolation and through-substrate vias into integrated circuit designs Sailesh Mansinh Merchant, John W. Osenbach 2017-04-04
9443821 Pb-free solder bumps with improved mechanical properties John W. Osenbach 2016-09-13
9054064 Stacked interconnect heat sink John W. Osenbach, Sailesh Mansinh Merchant 2015-06-09
8987137 Method of fabrication of through-substrate vias Sailesh Mansinh Merchant, John W. Osenbach 2015-03-24
8779587 PB-free solder bumps with improved mechanical properties John W. Osenbach 2014-07-15
8742535 Integration of shallow trench isolation and through-substrate vias into integrated circuit designs Sailesh Mansinh Merchant, John W. Osenbach 2014-06-03
8580621 Solder interconnect by addition of copper John W. Osenbach, Kishor Desai 2013-11-12
8507317 Solder bump structure for flip chip semiconductor devices and method of manufacturing therefore Donald S. Bitting, Sailesh Chittipeddi, Seung H. Kang, Sailesh Mansinh Merchant 2013-08-13
8492911 Stacked interconnect heat sink John W. Osenbach, Sailesh Mansinh Merchant 2013-07-23
8378485 Solder interconnect by addition of copper John W. Osenbach, Kishor Desai 2013-02-19
8319343 Routing under bond pad for the replacement of an interconnect layer Vance D. Archer, III, Michael AYUKAWA, Daniel Chesire, Seung H. Kang, Taeho Kook +2 more 2012-11-27
7952206 Solder bump structure for flip chip semiconductor devices and method of manufacture therefore Donald S. Bitting, Sailesh Chittipeddi, Seung H. Kang, Sailesh Mansinh Merchant 2011-05-31
7777333 Structure and method for fabricating flip chip devices Donald S. Bitting, Daniel Chesire, Taeho Kook, Sailesh Mansinh Merchant 2010-08-17
7724359 Method of making electronic entities Ahmed Amin, Frank Baiocchi, John M. DeLucca, John W. Osenbach 2010-05-25
7671436 Electronic packages Ahmed Amin, David Crouthamel, John W. Osenbach, Brian T. Vaccaro 2010-03-02
7479695 Low thermal resistance assembly for flip chip applications David Crouthamel 2009-01-20
7328830 Structure and method for bonding to copper interconnect structures Daniel Chesire, Sailesh Mansinh Merchant 2008-02-12
7221173 Method and structures for testing a semiconductor wafer prior to performing a flip chip bumping process Daniel Chesire, Taeho Kook, Sailesh Mansinh Merchant 2007-05-22
6960836 Reinforced bond pad Daniel Chesire, Sailesh Mansinh Merchant, John W. Osenbach, Kurt G. Steiner 2005-11-01