| 10476481 |
Acoustic filtering circuitry including capacitor |
Alan S. Chen, Kurt G. Steiner, Benjamin Paul Abbott, Scott F. Shive, Jean Briot |
2019-11-12 |
$24,333,000 |
| 8552819 |
High coupling, low loss saw filter and associated method |
Benjamin Paul Abbott, Alan S. Chen, Kurt G. Steiner, Robert Aigner, Suzanne Combe +3 more |
2013-10-08 |
$11,930,000 |
| 8319343 |
Routing under bond pad for the replacement of an interconnect layer |
Vance D. Archer, III, Michael AYUKAWA, Mark A. Bachman, Daniel Chesire, Seung H. Kang +2 more |
2012-11-27 |
|
| 8294331 |
Acoustic wave guide device and method for minimizing trimming effects and piston mode instabilities |
Benjamin Paul Abbott, Robert Aigner, Alan S. Chen, Julien Gratier, Marc Solal +1 more |
2012-10-23 |
$4,327,000 |
| 8241986 |
Semiconductor device and process for reducing damaging breakdown in gate dielectrics |
Tanya Nigam, Bonnie E. Weir |
2012-08-14 |
|
| 8089130 |
Semiconductor device and process for reducing damaging breakdown in gate dielectrics |
Tanya Nigam, Bonnie E. Weir |
2012-01-03 |
|
| 8044553 |
Temperature compensated surface acoustic wave device and method having buried interdigital transducers for providing an improved insertion loss and quality factor |
Alan S. Chen, Kurt G. Steiner, Stephen A. Neston, Timothy Daniel |
2011-10-25 |
$12,339,000 |
| 8035464 |
Bonded wafer SAW filters and methods |
Benjamin Paul Abbott, Robert Aigner, Julien Gratier |
2011-10-11 |
$15,203,000 |
| 8030199 |
Transistor fabrication method |
Sailesh Chittipeddi, Avinoam Kornblit |
2011-10-04 |
|
| 7973544 |
Thermal monitoring and management of integrated circuits |
Vance D. Archer, III, Daniel Chesire, Warren K. Gladden, Seung H. Kang, Sailesh Mansinh Merchant +1 more |
2011-07-05 |
|
| 7939987 |
Acoustic wave device employing reflective elements for confining elastic energy |
Marc Solal, Robert Aigner, Julien Gratier, Benjamin Paul Abbott |
2011-05-10 |
$10,309,000 |
| 7777333 |
Structure and method for fabricating flip chip devices |
Mark A. Bachman, Donald S. Bitting, Daniel Chesire, Sailesh Mansinh Merchant |
2010-08-17 |
|
| 7429502 |
Integrated circuit device incorporating metallurgical bond to enhance thermal conduction to a heat sink |
Vance D. Archer, III, Kouros Azimi, Daniel Chesire, Warren K. Gladden, Seung H. Kang +2 more |
2008-09-30 |
|
| 7397103 |
Semiconductor with damage detection circuitry |
Vance D. Archer, III, Daniel Chesire, Seung H. Kang, Sailesh Mansinh Merchant |
2008-07-08 |
|
| 7327029 |
Integrated circuit device incorporating metallurigical bond to enhance thermal conduction to a heat sink |
Vance D. Archer, III, Kouros Azimi, Daniel Chesire, Warren K. Gladden, Seung H. Kang +2 more |
2008-02-05 |
|
| 7301231 |
Reinforced bond pad for a semiconductor device |
Joze E. Antol, Philip William Seitzer, Daniel Chesire, Rafe Carl Mengel, Vance D. Archer, III +2 more |
2007-11-27 |
|
| 7221173 |
Method and structures for testing a semiconductor wafer prior to performing a flip chip bumping process |
Mark A. Bachman, Daniel Chesire, Sailesh Mansinh Merchant |
2007-05-22 |
|
| 7115985 |
Reinforced bond pad for a semiconductor device |
Joze E. Antol, Philip William Seitzer, Daniel Chesire, Rafe Carl Mengel, Vance D. Archer, III +2 more |
2006-10-03 |
$4,563,000 |
| 6498080 |
Transistor fabrication method |
Sailesh Chittipeddi, Avinoam Kornblit |
2002-12-24 |
|
| 6008123 |
Method for using a hardmask to form an opening in a semiconductor substrate |
Alvaro Maury, Kurt G. Steiner, Tungsheng Yang |
1999-12-28 |
$61,728,000 |
| 5945355 |
Integrated circuit fabrication |
Larry Bruce Fritzinger, Kuo-Hua Lee |
1999-08-31 |
$60,855,000 |
| 5891784 |
Transistor fabrication method |
Wan Yee Cheung, Sailesh Chittipeddi, Chong-Cheng Fu, Avinoam Kornblit, Steven Alan Lytle +2 more |
1999-04-06 |
$98,445,000 |
| 5589303 |
Self-aligned opaque regions for attenuating phase-shifting masks |
John J. DeMarco, Robert L. Kostelak, Jr. |
1996-12-31 |
$7,282,000 |
| 5573965 |
Method of fabricating semiconductor devices and integrated circuits using sidewall spacer technology |
Min-Liang Chen, Sailesh Chittipeddi, Richard A. Powell, Pradip K. Roy |
1996-11-12 |
$10,324,000 |
| 5326727 |
Method for integrated circuit fabrication including linewidth control during etching |
Avinoam Kornblit, Kolawole R. Olasupo |
1994-07-05 |
|