Issued Patents All Time
Showing 25 most recent of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10476481 | Acoustic filtering circuitry including capacitor | Alan S. Chen, Kurt G. Steiner, Benjamin Paul Abbott, Scott F. Shive, Jean Briot | 2019-11-12 |
| 8552819 | High coupling, low loss saw filter and associated method | Benjamin Paul Abbott, Alan S. Chen, Kurt G. Steiner, Robert Aigner, Suzanne Combe +3 more | 2013-10-08 |
| 8319343 | Routing under bond pad for the replacement of an interconnect layer | Vance D. Archer, III, Michael AYUKAWA, Mark A. Bachman, Daniel Chesire, Seung H. Kang +2 more | 2012-11-27 |
| 8294331 | Acoustic wave guide device and method for minimizing trimming effects and piston mode instabilities | Benjamin Paul Abbott, Robert Aigner, Alan S. Chen, Julien Gratier, Marc Solal +1 more | 2012-10-23 |
| 8241986 | Semiconductor device and process for reducing damaging breakdown in gate dielectrics | Tanya Nigam, Bonnie E. Weir | 2012-08-14 |
| 8089130 | Semiconductor device and process for reducing damaging breakdown in gate dielectrics | Tanya Nigam, Bonnie E. Weir | 2012-01-03 |
| 8044553 | Temperature compensated surface acoustic wave device and method having buried interdigital transducers for providing an improved insertion loss and quality factor | Alan S. Chen, Kurt G. Steiner, Stephen A. Neston, Timothy Daniel | 2011-10-25 |
| 8035464 | Bonded wafer SAW filters and methods | Benjamin Paul Abbott, Robert Aigner, Julien Gratier | 2011-10-11 |
| 8030199 | Transistor fabrication method | Sailesh Chittipeddi, Avinoam Kornblit | 2011-10-04 |
| 7973544 | Thermal monitoring and management of integrated circuits | Vance D. Archer, III, Daniel Chesire, Warren K. Gladden, Seung H. Kang, Sailesh Mansinh Merchant +1 more | 2011-07-05 |
| 7939987 | Acoustic wave device employing reflective elements for confining elastic energy | Marc Solal, Robert Aigner, Julien Gratier, Benjamin Paul Abbott | 2011-05-10 |
| 7777333 | Structure and method for fabricating flip chip devices | Mark A. Bachman, Donald S. Bitting, Daniel Chesire, Sailesh Mansinh Merchant | 2010-08-17 |
| 7429502 | Integrated circuit device incorporating metallurgical bond to enhance thermal conduction to a heat sink | Vance D. Archer, III, Kouros Azimi, Daniel Chesire, Warren K. Gladden, Seung H. Kang +2 more | 2008-09-30 |
| 7397103 | Semiconductor with damage detection circuitry | Vance D. Archer, III, Daniel Chesire, Seung H. Kang, Sailesh Mansinh Merchant | 2008-07-08 |
| 7327029 | Integrated circuit device incorporating metallurigical bond to enhance thermal conduction to a heat sink | Vance D. Archer, III, Kouros Azimi, Daniel Chesire, Warren K. Gladden, Seung H. Kang +2 more | 2008-02-05 |
| 7301231 | Reinforced bond pad for a semiconductor device | Joze E. Antol, Philip William Seitzer, Daniel Chesire, Rafe Carl Mengel, Vance D. Archer, III +2 more | 2007-11-27 |
| 7221173 | Method and structures for testing a semiconductor wafer prior to performing a flip chip bumping process | Mark A. Bachman, Daniel Chesire, Sailesh Mansinh Merchant | 2007-05-22 |
| 7115985 | Reinforced bond pad for a semiconductor device | Joze E. Antol, Philip William Seitzer, Daniel Chesire, Rafe Carl Mengel, Vance D. Archer, III +2 more | 2006-10-03 |
| 6498080 | Transistor fabrication method | Sailesh Chittipeddi, Avinoam Kornblit | 2002-12-24 |
| 6008123 | Method for using a hardmask to form an opening in a semiconductor substrate | Alvaro Maury, Kurt G. Steiner, Tungsheng Yang | 1999-12-28 |
| 5945355 | Integrated circuit fabrication | Larry Bruce Fritzinger, Kuo-Hua Lee | 1999-08-31 |
| 5891784 | Transistor fabrication method | Wan Yee Cheung, Sailesh Chittipeddi, Chong-Cheng Fu, Avinoam Kornblit, Steven Alan Lytle +2 more | 1999-04-06 |
| 5589303 | Self-aligned opaque regions for attenuating phase-shifting masks | John J. DeMarco, Robert L. Kostelak, Jr. | 1996-12-31 |
| 5573965 | Method of fabricating semiconductor devices and integrated circuits using sidewall spacer technology | Min-Liang Chen, Sailesh Chittipeddi, Richard A. Powell, Pradip K. Roy | 1996-11-12 |
| 5326727 | Method for integrated circuit fabrication including linewidth control during etching | Avinoam Kornblit, Kolawole R. Olasupo | 1994-07-05 |