| 8319343 |
Routing under bond pad for the replacement of an interconnect layer |
Michael AYUKAWA, Mark A. Bachman, Daniel Chesire, Seung H. Kang, Taeho Kook +2 more |
2012-11-27 |
| 7973544 |
Thermal monitoring and management of integrated circuits |
Daniel Chesire, Warren K. Gladden, Seung H. Kang, Taeho Kook, Sailesh Mansinh Merchant +1 more |
2011-07-05 |
| 7429502 |
Integrated circuit device incorporating metallurgical bond to enhance thermal conduction to a heat sink |
Kouros Azimi, Daniel Chesire, Warren K. Gladden, Seung H. Kang, Taeho Kook +2 more |
2008-09-30 |
| 7397103 |
Semiconductor with damage detection circuitry |
Daniel Chesire, Seung H. Kang, Taeho Kook, Sailesh Mansinh Merchant |
2008-07-08 |
| 7327029 |
Integrated circuit device incorporating metallurigical bond to enhance thermal conduction to a heat sink |
Kouros Azimi, Daniel Chesire, Warren K. Gladden, Seung H. Kang, Taeho Kook +2 more |
2008-02-05 |
| 7301231 |
Reinforced bond pad for a semiconductor device |
Joze E. Antol, Philip William Seitzer, Daniel Chesire, Rafe Carl Mengel, Thomas B. Gans +2 more |
2007-11-27 |
| 7115985 |
Reinforced bond pad for a semiconductor device |
Joze E. Antol, Philip William Seitzer, Daniel Chesire, Rafe Carl Mengel, Thomas B. Gans +2 more |
2006-10-03 |