Patents per Year
Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 8183698 | Bond pad support structure for semiconductor device | John W. Osenbach, Kurt G. Steiner | 2012-05-22 | |
| 7888257 | Integrated circuit package including wire bonds | John W. Osenbach, Ronald J. Weachock | 2011-02-15 | |
| 7727781 | Manufacture of devices including solder bumps | Kishor Desai, John W. Osenbach, Brian T. Vaccaro | 2010-06-01 | |
| 7301231 | Reinforced bond pad for a semiconductor device | Philip William Seitzer, Daniel Chesire, Rafe Carl Mengel, Vance D. Archer, III, Thomas B. Gans +2 more | 2007-11-27 | |
| 7115985 | Reinforced bond pad for a semiconductor device | Philip William Seitzer, Daniel Chesire, Rafe Carl Mengel, Vance D. Archer, III, Thomas B. Gans +2 more | 2006-10-03 | $4,563,000 |
| 6146909 | Detecting trace levels of copper | David Coult, Gustav E. Derkits, Jr., Franklin Roy Dietz, Nur Selamoglu | 2000-11-14 | $30,398,000 |