Issued Patents All Time
Showing 25 most recent of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12271252 | Increasing the robustness of electronic systems against SEU and other radiation effects | Luis Angel Maestro Ruiz De Temino, Jerzy Kolek, Slawomir Cichon, Pratibha Gupta, Kiran Patel | 2025-04-08 |
| 7009299 | Kinetically controlled solder | David L. Angst, David Coult, John W. Osenbach, Brian Stauffer Auker | 2006-03-07 |
| 6835984 | ESD resistant device | Leslie Marchut, Franklin R. Nash | 2004-12-28 |
| 6625367 | Optoelectronic device having a P-contact and an N-contact located over a same side of a substrate and a method of manufacture therefor | David Coult, Charles Lentz, Bryan P. Segner | 2003-09-23 |
| 6590913 | Barrier layer and method of making the same | Bernard Caras, David Coult, Charles Lentz, Debra L. Waltemyer | 2003-07-08 |
| 6555457 | Method of forming a laser circuit having low penetration ohmic contact providing impurity gettering and the resultant laser circuit | William R. Heffner, Padman Parayanthal, Patrick Carroll, Ranjani Muthiah | 2003-04-29 |
| 6520348 | Multiple inclined wafer holder for improved vapor transport and reflux for sealed ampoule diffusion process | Dutt V. Bulusu, Robert L. Mcanally, Michael Geva, Robert A. Resta | 2003-02-18 |
| 6490033 | Method of thin film process control and calibration standard for optical profilometry step height measurement | David Coult, Franklin Roy Dietz, Ranjani Muthiah, Sonja Radelow | 2002-12-03 |
| 6489232 | ESD resistant device | Leslie Marchut, Franklin R. Nash | 2002-12-03 |
| 6437868 | In-situ automated contactless thickness measurement for wafer thinning | David Coult, Duane Donald Wendling, Charles Lentz, Bryan P. Segner, Wan-ning Wu +1 more | 2002-08-20 |
| 6342442 | Kinetically controlled solder bonding | David L. Angst, David Coult, John W. Osenbach, Brian Stauffer Auker | 2002-01-29 |
| 6320265 | Semiconductor device with high-temperature ohmic contact and method of forming the same | Utpal Kumar Chakrabarti | 2001-11-20 |
| 6255707 | Semiconductor laser reliability test structure and method | Richard B. Bylsma, William R. Heffner | 2001-07-03 |
| 6253005 | Apparatus and method for compensating for misalignment in reflective packages | Ernest Eisenhardt Bergmann | 2001-06-26 |
| 6249619 | Optical isolator | Ernest Eisenhardt Bergmann, Ralph Stephen Jameson | 2001-06-19 |
| 6222863 | Article comprising a stable, low-resistance ohmic contact | Marlin Focht, Daniel Paul Wilt, Robert F. Karlicek, Jr. | 2001-04-24 |
| 6210546 | Fixture with at least one trough and method of using the fixture in a plasma or ion beam | David Coult, Walter J. Shakespeare, Duane Donald Wendling, Frederick Arthur Yeagle | 2001-04-03 |
| 6184582 | Article comprising a standoff complaint metallization and a method for making same | David Coult, Bryan P. Segner | 2001-02-06 |
| 6146909 | Detecting trace levels of copper | Joze E. Antol, David Coult, Franklin Roy Dietz, Nur Selamoglu | 2000-11-14 |
| 6112000 | Reflective array multiplexer with polarization compensation | Ernest Eisenhardt Bergmann, Ralph Stephen Jameson | 2000-08-29 |
| 6064522 | Miniature mass producible non-reciprocal devices | Ernest Eisenhardt Bergmann | 2000-05-16 |
| 6015998 | Flexibility control in optical materials | Ernest Eisenhardt Bergmann | 2000-01-18 |
| 5995293 | Optical components having magnetic thin films for orientation and method of assembling same | John VanAtta Gates, II | 1999-11-30 |
| 5989637 | Method for preventing facet coating overspray | John S. Rizzo, Raymond Frank Gruszka, John Boyd | 1999-11-23 |
| 5990560 | Method and compositions for achieving a kinetically controlled solder bond | David Coult, John W. Osenbach, Yiu-Man Wong | 1999-11-23 |