Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6437868 | In-situ automated contactless thickness measurement for wafer thinning | David Coult, Charles Lentz, Bryan P. Segner, Gustav E. Derkits, Jr., Wan-ning Wu +1 more | 2002-08-20 |
| 6210546 | Fixture with at least one trough and method of using the fixture in a plasma or ion beam | David Coult, Gustav E. Derkits, Jr., Walter J. Shakespeare, Frederick Arthur Yeagle | 2001-04-03 |