Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5990560 | Method and compositions for achieving a kinetically controlled solder bond | David Coult, Gustav E. Derkits, Jr., John W. Osenbach | 1999-11-23 |
| 5234153 | Permanent metallic bonding method | Donlad D. Bacon, Avishay Katz, Chien-Hsun Lee, King Lien Tai | 1993-08-10 |
| 5197654 | Bonding method using solder composed of multiple alternating gold and tin layers | Avishay Katz, Chien-Hsun Lee, King Lien Tai | 1993-03-30 |
| 5194948 | Article alignment method and apparatus | Leroy D. L'Esperance, III, Hung Nguyen | 1993-03-16 |
| 5152055 | Article alignment method | Leroy D. L'Esperance, III, Hung Nguyen | 1992-10-06 |
| 4999317 | Metallization processing | Chih-Yuan Lu, Janmye Sung | 1991-03-12 |