Issued Patents All Time
Showing 25 most recent of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7259077 | Integrated passive devices | Yinon Degani, Maureen Y. Lau | 2007-08-21 |
| 7061258 | Testing integrated circuits | Yinon Degani, Charley Chunlei Gao | 2006-06-13 |
| 6867607 | Membrane test method and apparatus for integrated circuit testing | Yinon Degani, Charley Chunlei Gao | 2005-03-15 |
| 6683384 | Air isolated crossovers | Dean Paul Kossives, Fan Ren | 2004-01-27 |
| 6680212 | Method of testing and constructing monolithic multi-chip modules | Yinon Degani, Thomas Dixon Dudderar | 2004-01-20 |
| 6678167 | High performance multi-chip IC package | Yinon Degani, Thomas Dixon Dudderar | 2004-01-13 |
| 6560735 | Methods and apparatus for testing integrated circuits | Louis Nelson Ahlquist, Yinon Degani, Jericho Jacala, Dean Paul Kossives | 2003-05-06 |
| 6465336 | Circuit and method for providing interconnections among individual integrated circuit chips in a multi-chip module | Thaddeus John Gabara | 2002-10-15 |
| 6437990 | Multi-chip ball grid array IC packages | Yinon Degani, Thomas Dixon Dudderar | 2002-08-20 |
| 6433411 | Packaging micromechanical devices | Yinon Degani, Thomas Dixon Dudderar | 2002-08-13 |
| 6396711 | Interconnecting micromechanical devices | Yinon Degani, Thomas Dixon Dudderar | 2002-05-28 |
| 6369444 | Packaging silicon on silicon multichip modules | Yinon Degani, Thomas Dixon Dudderar | 2002-04-09 |
| 6281590 | Circuit and method for providing interconnections among individual integrated circuit chips in a multi-chip module | Thaddeus John Gabara | 2001-08-28 |
| 6251705 | Low profile integrated circuit packages | Yinon Degani, Thomas Dixon Dudderar | 2001-06-26 |
| 6232047 | Fabricating high-Q RF components | Robert C. Frye, Yee Leng Low | 2001-05-15 |
| 6175158 | Interposer for recessed flip-chip package | Yinon Degani, Thomas Dixon Dudderar, Robert C. Frye | 2001-01-16 |
| 6160715 | Translator for recessed flip-chip package | Yinon Degani, Thomas Dixon Dudderar, Robert C. Frye | 2000-12-12 |
| 6100475 | Solder bonding printed circuit boards | Yinon Degani | 2000-08-08 |
| 6077725 | Method for assembling multichip modules | Yinon Degani, Thomas Dixon Dudderar | 2000-06-20 |
| 6075427 | MCM with high Q overlapping resonator | Jingsong Zhao | 2000-06-13 |
| 6075691 | Thin film capacitors and process for making them | Salvador Duenas, Ratnaji R. Kola, Henry Y. Kumagai, Maureen Y. Lau, Paul A. Sullivan | 2000-06-13 |
| 6029224 | Self-contained memory apparatus having diverse types of memory and distributed control | Abhaya Asthana, Douglas E. Haggan | 2000-02-22 |
| 6013877 | Solder bonding printed circuit boards | Yinon Degani | 2000-01-11 |
| 5990564 | Flip chip packaging of memory chips | Yinon Degani, Thomas Dixon Dudderar | 1999-11-23 |
| 5936831 | Thin film tantalum oxide capacitors and resulting product | Ratnaji R. Kola | 1999-08-10 |