DK

Dean Paul Kossives

AT AT&T: 9 patents #2,000 of 18,772Top 15%
AS Agere Systems: 5 patents #269 of 1,849Top 15%
AG Agere Systems Guardian: 3 patents #85 of 810Top 15%
SC Stats Chippac: 3 patents #180 of 425Top 45%
SS St Assembly Test Services: 1 patents #36 of 63Top 60%
Overall (All Time): #211,094 of 4,157,543Top 6%
21
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
7733661 Chip carrier and fabrication method Byung Joon Han 2010-06-08
7525812 Chip carrier and fabrication method Byung Joon Han 2009-04-28
7304859 Chip carrier and fabrication method Byung Joon Han 2007-12-04
7091469 Packaging for optoelectronic devices Kambhampati Ramakrishna, Edward Law, Diane Sahakian, Theodore G. Tessier, Jamin Ling 2006-08-15
7021518 Micromagnetic device for power processing applications and method of manufacture therefor Ashraf W. Lotfi, Lynn F. Schneemeyer, Michael L. Steigerwald, R. Bruce Van Dover 2006-04-04
6696744 Integrated circuit having a micromagnetic device and method of manufacture therefor Anatoly Feygenson, Ashraf W. Lotfi, Lynn F. Schneemeyer, Michael L. Steigerwald, R. Bruce Van Dover 2004-02-24
6683384 Air isolated crossovers Fan Ren, King Lien Tai 2004-01-27
6649422 Integrated circuit having a micromagnetic device and method of manufacture therefor Ashraf W. Lotfi, Lynn F. Schneemeyer, Michael L. Steigerwald, R. Bruce Van Dover 2003-11-18
6560735 Methods and apparatus for testing integrated circuits Louis Nelson Ahlquist, Yinon Degani, Jericho Jacala, King Lien Tai 2003-05-06
6440750 Method of making integrated circuit having a micromagnetic device Anatoly Feygenson, Ashraf W. Lotfi, Lynn F. Schneemeyer, Michael L. Steigerwald, R. Bruce Van Dover 2002-08-27
6370766 Manufacture of printed circuit cards Yinon Degani, Thomas Dixon Dudderar, Yee Leng Low 2002-04-16
6297551 Integrated circuit packages with improved EMI characteristics Thomas Dixon Dudderar, Yee Leng Low 2001-10-02
6255714 Integrated circuit having a micromagnetic device including a ferromagnetic core and method of manufacture therefor Ashraf W. Lotfi, Lynn F. Schneemeyer, Michael L. Steigerwald, R. Bruce Van Dover 2001-07-03
6232212 Flip chip bump bonding Yinon Degani 2001-05-15
6191495 Micromagnetic device having an anisotropic ferromagnetic core and method of manufacture therefor Ashraf W. Lotfi, Lynn F. Schneemeyer, Michael L. Steigerwald, R. Bruce Van Dover 2001-02-20
6163234 Micromagnetic device for data transmission applications and method of manufacture therefor Ashraf W. Lotfi, Lynn F. Schneemeyer, Michael L. Steigerwald, R. Bruce Van Dover 2000-12-19
6160721 Micromagnetic device for power processing applications and method of manufacture therefor Ashraf W. Lotfi, Lynn F. Schneemeyer, Michael L. Steigerwald, R. Bruce Van Dover 2000-12-12
6118351 Micromagnetic device for power processing applications and method of manufacture therefor Ashraf W. Lotfi, Lynn F. Schneemeyer, Michael L. Steigerwald, R. Bruce Van Dover 2000-09-12
5778913 Cleaning solder-bonded flip-chip assemblies Yinon Degani, Thomas Dixon Dudderar 1998-07-14
5516728 Process for fabircating an integrated circuit Yinon Degani 1996-05-14
5125560 Method of soldering including removal of flux residue Yinon Degani 1992-06-30