Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6734539 | Stacked module package | Yinon Degani, Liguo Sun, Meng Zhao | 2004-05-11 |
| 6680212 | Method of testing and constructing monolithic multi-chip modules | Yinon Degani, King Lien Tai | 2004-01-20 |
| 6678167 | High performance multi-chip IC package | Yinon Degani, King Lien Tai | 2004-01-13 |
| 6437990 | Multi-chip ball grid array IC packages | Yinon Degani, King Lien Tai | 2002-08-20 |
| 6433411 | Packaging micromechanical devices | Yinon Degani, King Lien Tai | 2002-08-13 |
| 6396711 | Interconnecting micromechanical devices | Yinon Degani, King Lien Tai | 2002-05-28 |
| 6370766 | Manufacture of printed circuit cards | Yinon Degani, Dean Paul Kossives, Yee Leng Low | 2002-04-16 |
| 6369444 | Packaging silicon on silicon multichip modules | Yinon Degani, King Lien Tai | 2002-04-09 |
| 6297551 | Integrated circuit packages with improved EMI characteristics | Dean Paul Kossives, Yee Leng Low | 2001-10-02 |
| 6282100 | Low cost ball grid array package | Yinon Degani, Robert C. Frye | 2001-08-28 |
| 6251705 | Low profile integrated circuit packages | Yinon Degani, King Lien Tai | 2001-06-26 |
| 6205745 | High speed flip-chip dispensing | Charles Gutentag | 2001-03-27 |
| 6175158 | Interposer for recessed flip-chip package | Yinon Degani, Robert C. Frye, King Lien Tai | 2001-01-16 |
| 6160715 | Translator for recessed flip-chip package | Yinon Degani, Robert C. Frye, King Lien Tai | 2000-12-12 |
| 6077725 | Method for assembling multichip modules | Yinon Degani, King Lien Tai | 2000-06-20 |
| 6020219 | Method of packaging fragile devices with a gel medium confined by a rim member | Byung Joon Han, Venkataram R. Raju, George J. Shevchuk | 2000-02-01 |
| 5990564 | Flip chip packaging of memory chips | Yinon Degani, King Lien Tai | 1999-11-23 |
| 5966903 | High speed flip-chip dispensing | Charles Gutentag | 1999-10-19 |
| 5778913 | Cleaning solder-bonded flip-chip assemblies | Yinon Degani, Dean Paul Kossives | 1998-07-14 |
| 5767447 | Electronic device package enclosed by pliant medium laterally confined by a plastic rim member | Byung Joon Han, Venkataram R. Raju, George J. Shevchuk | 1998-06-16 |
| 5646828 | Thin packaging of multi-chip modules with enhanced thermal/power management | Yinon Degani, Byung Joon Han, Alan Michael Lyons | 1997-07-08 |
| 5608262 | Packaging multi-chip modules without wire-bond interconnection | Yinon Degani, Byung Joon Han, Alan Michael Lyons, King Lien Tai | 1997-03-04 |
| 5564617 | Method and apparatus for assembling multichip modules | Yinon Degani, King Lien Tai | 1996-10-15 |
| 5505367 | Method for bumping silicon devices | Yinon Degani, John G. Spadafora | 1996-04-09 |
| 5473512 | Electronic device package having electronic device boonded, at a localized region thereof, to circuit board | Yinon Degani, Byung Joon Han, Venkataram R. Raju | 1995-12-05 |