Issued Patents All Time
Showing 26–29 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5382300 | Solder paste mixture | Greg E. Blonder, Yinon Degani | 1995-01-17 |
| 5346118 | Surface mount solder assembly of leadless integrated circuit packages to substrates | Yinon Degani, William L. Woods, Jr. | 1994-09-13 |
| 5307983 | Method of making an article comprising solder bump bonding | Chee Chong Wong | 1994-05-03 |
| 4928527 | Method and device for nondestructive evaluation | Christian Burger, John Gilbert, Bruce R. Peters, James A. Smith | 1990-05-29 |