Issued Patents All Time
Showing 1–25 of 57 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12398982 | Incoming threat protection system and method of using same | Arye Raybee, Gil Segev | 2025-08-26 |
| 8102021 | RF devices | — | 2012-01-24 |
| 8018027 | Flip-bonded dual-substrate inductor, flip-bonded dual-substrate inductor, and integrated passive device including a flip-bonded dual-substrate inductor | Tatsuo Bizen, Kunquan Sun | 2011-09-13 |
| 7936043 | Integrated passive device substrates | Yu Fan, Charley Chunlei Gao, Maureen Y. Lau, Kunquan Sun, Liguo Sun | 2011-05-03 |
| 7795709 | Shielding noisy conductors in integrated passive devices | Yu Fan, Charley Chunlei Gao, Kunguan Sun, Liguo Sun | 2010-09-14 |
| 7692511 | Compact balun transformers | Yu Fan, Charley Chunlei Gao, Kunquan Sun, Liguo Sun, Jian Cheng | 2010-04-06 |
| 7382056 | Integrated passive devices | Anthony M. Chiu, Charley Chunlei Gao, Kunquan Sun, Liquo Sun | 2008-06-03 |
| 7355264 | Integrated passive devices with high Q inductors | Yinchao CHEN, Yu Fan, Charley Chunlei Gao, Kunquan Sun, Liquo Sun | 2008-04-08 |
| 7259077 | Integrated passive devices | Maureen Y. Lau, King Lien Tai | 2007-08-21 |
| 7170754 | SDIO memory and interface card | Moses Asom, Joe Ryan, Kunquan Sun, Yanbing Yu, Meng Zhao | 2007-01-30 |
| 7061258 | Testing integrated circuits | Charley Chunlei Gao, King Lien Tai | 2006-06-13 |
| 6867607 | Membrane test method and apparatus for integrated circuit testing | Charley Chunlei Gao, King Lien Tai | 2005-03-15 |
| 6734539 | Stacked module package | Thomas Dixon Dudderar, Liguo Sun, Meng Zhao | 2004-05-11 |
| 6680212 | Method of testing and constructing monolithic multi-chip modules | Thomas Dixon Dudderar, King Lien Tai | 2004-01-20 |
| 6678167 | High performance multi-chip IC package | Thomas Dixon Dudderar, King Lien Tai | 2004-01-13 |
| 6597069 | Flip chip metallization | Jeffrey Alan Gregus | 2003-07-22 |
| 6560735 | Methods and apparatus for testing integrated circuits | Louis Nelson Ahlquist, Jericho Jacala, Dean Paul Kossives, King Lien Tai | 2003-05-06 |
| 6437990 | Multi-chip ball grid array IC packages | Thomas Dixon Dudderar, King Lien Tai | 2002-08-20 |
| 6433411 | Packaging micromechanical devices | Thomas Dixon Dudderar, King Lien Tai | 2002-08-13 |
| 6396711 | Interconnecting micromechanical devices | Thomas Dixon Dudderar, King Lien Tai | 2002-05-28 |
| 6370766 | Manufacture of printed circuit cards | Thomas Dixon Dudderar, Dean Paul Kossives, Yee Leng Low | 2002-04-16 |
| 6369444 | Packaging silicon on silicon multichip modules | Thomas Dixon Dudderar, King Lien Tai | 2002-04-09 |
| 6342399 | Testing integrated circuits | — | 2002-01-29 |
| 6282100 | Low cost ball grid array package | Thomas Dixon Dudderar, Robert C. Frye | 2001-08-28 |
| 6251705 | Low profile integrated circuit packages | Thomas Dixon Dudderar, King Lien Tai | 2001-06-26 |