Issued Patents All Time
Showing 26–50 of 57 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6232212 | Flip chip bump bonding | Dean Paul Kossives | 2001-05-15 |
| 6175158 | Interposer for recessed flip-chip package | Thomas Dixon Dudderar, Robert C. Frye, King Lien Tai | 2001-01-16 |
| 6160715 | Translator for recessed flip-chip package | Thomas Dixon Dudderar, Robert C. Frye, King Lien Tai | 2000-12-12 |
| 6154370 | Recessed flip-chip package | Robert C. Frye, Yee Leng Low | 2000-11-28 |
| 6130141 | Flip chip metallization | Jeffrey Alan Gregus | 2000-10-10 |
| 6100475 | Solder bonding printed circuit boards | King Lien Tai | 2000-08-08 |
| 6077725 | Method for assembling multichip modules | Thomas Dixon Dudderar, King Lien Tai | 2000-06-20 |
| 6074897 | Integrated circuit bonding method and apparatus | Lawrence Greenberg | 2000-06-13 |
| 6043670 | Method for testing integrated circuits | Alan Michael Lyons | 2000-03-28 |
| 6015652 | Manufacture of flip-chip device | Louis Nelson Ahlquist | 2000-01-18 |
| 6013877 | Solder bonding printed circuit boards | King Lien Tai | 2000-01-11 |
| 5990564 | Flip chip packaging of memory chips | Thomas Dixon Dudderar, King Lien Tai | 1999-11-23 |
| 5904859 | Flip chip metallization | — | 1999-05-18 |
| 5869894 | RF IC package | Peter R. Smith, King Lien Tai | 1999-02-09 |
| 5796900 | Apparatus and methods for interconnecting arrays of optical transmission paths employing externally located connector pads | Herman M. Presby | 1998-08-18 |
| 5778913 | Cleaning solder-bonded flip-chip assemblies | Thomas Dixon Dudderar, Dean Paul Kossives | 1998-07-14 |
| 5646828 | Thin packaging of multi-chip modules with enhanced thermal/power management | Thomas Dixon Dudderar, Byung Joon Han, Alan Michael Lyons | 1997-07-08 |
| 5608262 | Packaging multi-chip modules without wire-bond interconnection | Thomas Dixon Dudderar, Byung Joon Han, Alan Michael Lyons, King Lien Tai | 1997-03-04 |
| 5564617 | Method and apparatus for assembling multichip modules | Thomas Dixon Dudderar, King Lien Tai | 1996-10-15 |
| 5516728 | Process for fabircating an integrated circuit | Dean Paul Kossives | 1996-05-14 |
| 5505367 | Method for bumping silicon devices | Thomas Dixon Dudderar, John G. Spadafora | 1996-04-09 |
| 5473512 | Electronic device package having electronic device boonded, at a localized region thereof, to circuit board | Thomas Dixon Dudderar, Byung Joon Han, Venkataram R. Raju | 1995-12-05 |
| 5385290 | Soldering material and procedure | — | 1995-01-31 |
| 5382300 | Solder paste mixture | Greg E. Blonder, Thomas Dixon Dudderar | 1995-01-17 |
| 5346118 | Surface mount solder assembly of leadless integrated circuit packages to substrates | Thomas Dixon Dudderar, William L. Woods, Jr. | 1994-09-13 |