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Method and system for automated value transfer |
Donald C. Licciardello, Alex Peterhans, David Romero, Debra Lynn Licciardello |
2008-08-26 |
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Method and system for automated value transfer |
Donald C. Licciardello, Alex Peterhans, David Romero, Debra Lynn Licciardello |
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Power and ground and signal layout for higher density integrated circuit connections with flip-chip bonding |
— |
2000-10-31 |
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Semiconductor package with high density I/O lead connection |
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2000-10-03 |
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Integrated circuit bonding method and apparatus |
Yinon Degani |
2000-06-13 |
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Finishing techniques for lensed optical fibers |
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1992-03-31 |
| 4774635 |
Semiconductor package with high density I/O lead connection |
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1988-09-27 |
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1988-01-05 |
| 4279400 |
Hot top for ingot mold |
— |
1981-07-21 |