Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8038058 | Method and system for automated value transfer | Donald C. Licciardello, Alex Peterhans, David Romero, Debra Lynn Licciardello | 2011-10-18 |
| 7416115 | Method and system for automated value transfer | Donald C. Licciardello, Alex Peterhans, David Romero, Debra Lynn Licciardello | 2008-08-26 |
| 7195151 | Method and system for automated value transfer | Donald C. Licciardello, Alex Peterhans, David Romero, Debra Lynn Licciardello | 2007-03-27 |
| 6140710 | Power and ground and signal layout for higher density integrated circuit connections with flip-chip bonding | — | 2000-10-31 |
| RE36894 | Semiconductor package with high density I/O lead connection | David Lando | 2000-10-03 |
| 6074897 | Integrated circuit bonding method and apparatus | Yinon Degani | 2000-06-13 |
| 5100507 | Finishing techniques for lensed optical fibers | Mark B. Cholewa, Lee H. Fisher | 1992-03-31 |
| 4774635 | Semiconductor package with high density I/O lead connection | David Lando | 1988-09-27 |
| 4717066 | Method of bonding conductors to semiconductor devices | Tsvi Goldenberg, Kenneth P. Moll | 1988-01-05 |
| 4279400 | Hot top for ingot mold | — | 1981-07-21 |