Issued Patents All Time
Showing 25 most recent of 83 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12308326 | Electronic component with lid to manage radiation feedback | Zhunming Du, Christopher Sanabria, Timothy M. Gittemeier, Terry Hon, Tariq Lodhi | 2025-05-20 |
| 12087656 | Package architecture utilizing wafer to wafer bonding | Robert Charles Dry, Mihir K. Roy | 2024-09-10 |
| 11948893 | Electronic component with lid to manage radiation feedback | Zhunming Du, Christopher Sanabria, Timothy M. Gittemeier, Terry Hon, Tariq Lodhi | 2024-04-02 |
| 11699629 | Integrated circuit die stacked with backer die including capacitors and thermal vias | Bror Peterson, Andrew Arthur Ketterson | 2023-07-11 |
| 11637050 | Package architecture utilizing wafer to wafer bonding | Robert Charles Dry, Mihir K. Roy | 2023-04-25 |
| 11303009 | Packages for advanced antenna systems | Bror Peterson, Michael Arnold | 2022-04-12 |
| 10177064 | Air cavity package | Kevin J. Anderson, Tarak A. Railkar | 2019-01-08 |
| 9936587 | Method of fabricating a multi-channel modulator driver with enclosure | Craig Steinbeiser, Khiem Dinh | 2018-04-03 |
| 9899292 | Top-side cooling of RF products in air cavity composite packages | Craig Steinbeiser, Oleh Krutko, John Beall | 2018-02-20 |
| 9113549 | Enclosure for a multi-channel modulator driver | Craig Steinbeiser, Khiem Dinh | 2015-08-18 |
| 8524531 | System and method for improving solder joint reliability in an integrated circuit package | Tong Yan Tee | 2013-09-03 |
| 8367271 | Fuel cell device | — | 2013-02-05 |
| 8330258 | System and method for improving solder joint reliability in an integrated circuit package | Tong Yan Tee | 2012-12-11 |
| 8202667 | Fuel cell device | — | 2012-06-19 |
| 8202668 | Fuel cell device | — | 2012-06-19 |
| 8178250 | Fuel cell device | — | 2012-05-15 |
| 8163645 | Method for providing a redistribution metal layer in an integrated circuit | Danielle A. Thomas, Harry Michael Siegel, Antonio A. Do Bento Vieira | 2012-04-24 |
| 7786582 | System for providing a redistribution metal layer in an integrated circuit | Danielle A. Thomas, Harry Michael Siegel, Antonio A. Do Bento Vieira | 2010-08-31 |
| 7595017 | Method for using a pre-formed film in a transfer molding process for an integrated circuit | Harry Michael Siegel | 2009-09-29 |
| 7547483 | Fuel cell device | — | 2009-06-16 |
| 7534716 | System and method for venting pressure from an integrated circuit package sealed with a lid | Tom Lao | 2009-05-19 |
| 7482260 | System and method for increasing the strength of a bond made by a small diameter wire in ball bonding | — | 2009-01-27 |
| 7382056 | Integrated passive devices | Yinon Degani, Charley Chunlei Gao, Kunquan Sun, Liquo Sun | 2008-06-03 |
| 7323114 | Method of making optical elements for an optical disc system | Danielle A. Thomas | 2008-01-29 |
| 7265452 | System and method for increasing the strength of a bond made by a small diameter wire in ball bonding | — | 2007-09-04 |