Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8800391 | Piezo-resistive force sensor with bumps on membrane structure | Xueren Zhang, Andrea Lorenzo Vitali, Federico Giovanni Ziglioli, Bruno Biffi | 2014-08-12 |
| 8642396 | Ultra-thin quad flat no-lead (QFN) package | Kim-Yong Goh | 2014-02-04 |
| 8592980 | Carbon nanotube-modified low-K materials | Shanzhong Wang, Valeriy Nosik, Xueren Zhang | 2013-11-26 |
| 8524531 | System and method for improving solder joint reliability in an integrated circuit package | Anthony M. Chiu | 2013-09-03 |
| 8486824 | Enhancing metal/low-K interconnect reliability using a protection layer | Xueren Zhang, Shanzhong Wang, Valeriy Nosik, Jijie Zhou, Sridhar Idapalapati +2 more | 2013-07-16 |
| 8330258 | System and method for improving solder joint reliability in an integrated circuit package | Anthony M. Chiu | 2012-12-11 |
| 8217518 | Enhancing metal/low-K interconnect reliability using a protection layer | Xueren Zhang, Shanzhong Wang, Valeriy Nosik, Jijie Zhou, Sridhar Idapalapati +2 more | 2012-07-10 |
| 8018036 | Ultra-thin quad flat no-lead (QFN) package | Kim-Yong Goh | 2011-09-13 |
| 7196425 | Copper interposer for reducing warping of integrated circuit packages and method of making IC packages | Anthony M. Chiu | 2007-03-27 |