Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10658238 | Semiconductor packages having an electric device with a recess | Xueren Zhang, Yiyi Ma | 2020-05-19 |
| 9824924 | Semiconductor packages having an electric device with a recess | Xueren Zhang, Yiyi Ma | 2017-11-21 |
| 9679870 | Integrated circuit device with shaped leads and method of forming the device | Yiyi Ma, Xueren Zhang, Wei Zhen Goh | 2017-06-13 |
| 9620438 | Electronic device with heat dissipater | Roseanne Duca, Valter Motta, Xueren Zhang | 2017-04-11 |
| 9576912 | Wafer level chip scale package (WLCSP) having edge protection | Yiyi Ma, Xueren Zhang | 2017-02-21 |
| 9449912 | Integrated circuit (IC) card having an IC module and reduced bond wire stress and method of forming | Xueren Zhang, Roseanne Duca | 2016-09-20 |
| 9379034 | Method of making an electronic device including two-step encapsulation and related devices | Yiyi Ma, Xueren Zhang | 2016-06-28 |
| 9257372 | Surface mount package for a semiconductor integrated device, related assembly and manufacturing process | Roseanne Duca, Xueren Zhang, Kevin Formosa | 2016-02-09 |
| 8907465 | Methods and devices for packaging integrated circuits | Yiyi Ma, Wei Zhen Goh | 2014-12-09 |
| 8884422 | Flip-chip fan-out wafer level package for package-on-package applications, and method of manufacture | Jing-En Luan | 2014-11-11 |
| 8822267 | System in package manufacturing method using wafer-to-wafer bonding | How Yuan Hwang, Jay Maghirang, Yaohuang Huang, Phone Maw Hla, Edmond Soon | 2014-09-02 |
| 8796826 | Window clamp top plate for integrated circuit packaging | Xueren Zhang, Wingshenq Wong | 2014-08-05 |
| 8772943 | Offset of contact opening for copper pillars in flip chip packages | Xueren Zhang | 2014-07-08 |
| 8642396 | Ultra-thin quad flat no-lead (QFN) package | Tong Yan Tee | 2014-02-04 |
| 8637352 | Ball grid array to pin grid array conversion | — | 2014-01-28 |
| 8502394 | Multi-stacked semiconductor dice scale package structure and method of manufacturing same | — | 2013-08-06 |
| 8466997 | Fan-out wafer level package for an optical sensor and method of manufacture thereof | Jing-En Luan | 2013-06-18 |
| 8436255 | Fan-out wafer level package with polymeric layer for high reliability | — | 2013-05-07 |
| 8410598 | Semiconductor package and method of manufacturing the same | — | 2013-04-02 |
| 8389335 | Chip Scale Package structure with can attachment | Jing-En Luan | 2013-03-05 |
| 8164179 | Chip scale package structure with can attachment | Jing-En Luan | 2012-04-24 |
| 8018036 | Ultra-thin quad flat no-lead (QFN) package | Tong Yan Tee | 2011-09-13 |
| 7956475 | Step cavity for enhanced drop test performance in ball grid array package | Jing-En Luan | 2011-06-07 |
| 7361995 | Molded high density electronic packaging structure for high performance applications | Rahul Kapoor, Anthony Yi Sheng Sun, Desmond Yok Rue Chong, Lan H. Hoang | 2008-04-22 |