Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8822267 | System in package manufacturing method using wafer-to-wafer bonding | How Yuan Hwang, Jay Maghirang, Yaohuang Huang, Kim-Yong Goh, Phone Maw Hla | 2014-09-02 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8822267 | System in package manufacturing method using wafer-to-wafer bonding | How Yuan Hwang, Jay Maghirang, Yaohuang Huang, Kim-Yong Goh, Phone Maw Hla | 2014-09-02 |